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Xilinx XC5VLX30-1FFG676C

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 400 1179648 30720 676-BBGA, FCBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC5VLX30-1FFG676C

Datasheet: XC5VLX30-1FFG676C Datasheet (PDF)

Package/Case: BGA-676

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3616 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC5VLX30-1FFG676C General Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 400 1179648 30720 676-BBGA, FCBGA

xc5vlx30-1ffg676c

Features

  • Contains 30,816 logic cells and 1.5 Mb of memory
  • 600 MHz maximum operating frequency
  • Supports multiple I/O standards, including LVCMOS, LVTTL, HSTL, and LVDS
  • Contains built-in digital signal processing (DSP) blocks and memory controllers
  • Supports partial reconfiguration and dynamic reconfiguration

Application

  • Aerospace and defense
  • Automotive
  • Communications
  • Consumer electronics
  • Industrial control systems
  • Medical equipment
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Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
RoHS: Details Series: XC5VLX30
Number of Logic Elements: 30720 LE Adaptive Logic Modules - ALMs: 4800 ALM
Embedded Memory: 1.13 Mbit Number of I/Os: 400 I/O
Supply Voltage - Min: 950 mV Supply Voltage - Max: 1.05 V
Minimum Operating Temperature: 0 C Maximum Operating Temperature: + 85 C
Data Rate: - Number of Transceivers: -
Mounting Style: SMD/SMT Package / Case: FBGA-676
Brand: Xilinx Distributed RAM: 320 kbit
Embedded Block RAM - EBR: 1152 kbit Maximum Operating Frequency: 550 MHz
Moisture Sensitive: Yes Number of Logic Array Blocks - LABs: 2400 LAB
Operating Supply Voltage: 1 V Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 1 Subcategory: Programmable Logic ICs
Tradename: Virtex

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC5VLX30-1FFG676C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC5VLX30-1FFG324C

Brands :  

Package :   BGA324

Description :   XC5VLX30-1FFG324C - NEW PRODUCT

Part Number :   XC5VLX30-1FFG676I

Brands :  

Package :   BGA-676

Description :   FPGA Virtex®-5 LX Family 30720 Cells 65nm (CMOS) Technology 1V

Part Number :   XC5VLX30-1FFG676I-C

Brands :  

Package :  

Description :  

Part Number :   XC5VLX30-1FFG676CES

Brands :  

Package :  

Description :  

Part Number :   XC5VLX30-1FFG676CES-C

Brands :  

Package :  

Description :  

Part Number :   XC5VLX30-1FFG676I-ES

Brands :  

Package :  

Description :  

Part points

  • The XC5VLX30-1FFG676C chip is a high-performance Field Programmable Gate Array (FPGA) manufactured by Xilinx. It belongs to the Virtex-5 family and offers advanced features like programmable logic, configurable memory blocks, and high-speed serial interfaces. This chip is commonly used in various applications such as telecommunications, aerospace, and industrial automation.
  • Equivalent

    Some equivalent products of the XC5VLX30-1FFG676C chip are the XC5VLX30T-1FFG676C, XC5VLX30-1FF676C, XC5VLX30-1FFG324C, XC5VLX30-1FFG324C, and XC5VLX30T-FFG324-1.
  • Features

    XC5VLX30-1FFG676C is a high-performance field-programmable gate array (FPGA) with a capacity of 29,440 logic cells. It offers 800 inputs/outputs and has a maximum bandwidth of 5.2 Gbps. The FPGA supports advanced features like built-in PowerPC processor, embedded hard block IP cores, and advanced memory options, making it suitable for various applications requiring high-speed processing and flexible customization.
  • Pinout

    The XC5VLX30-1FFG676C FPGA has a pin count of 676. Its functions include programmable logic cells, DSP48E1 slices for high-performance signal processing, and 1.2V core voltage operation.
  • Manufacturer

    Xilinx is the manufacturer of the XC5VLX30-1FFG676C. Xilinx is a leading American technology company specializing in the development of programmable logic devices and associated software tools. They are known for their field-programmable gate arrays (FPGAs), which are widely used in various industries such as automotive, telecommunications, aerospace, and defense.
  • Application Field

    The XC5VLX30-1FFG676C is a field-programmable gate array (FPGA) that can be used in various application areas, including telecommunications, networking, automotive, and industrial control systems. It offers high-performance computation and flexible programmability, making it suitable for a wide range of design requirements.
  • Package

    The XC5VLX30-1FFG676C chip has a package type of FC676 and its form is BGA. The size of the chip is 27mm x 27mm.

Datasheet PDF

Preliminary Specification XC5VLX30-1FFG676C PDF Download

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