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$5000Xilinx XC7K70T-1FBG676C
Kintex®-7 Field Programmable Gate Array (FPGA) IC 300 4976640 65600 676-BBGA, FCBGA
Brands: XILINX
Mfr.Part #: XC7K70T-1FBG676C
Datasheet: XC7K70T-1FBG676C Datasheet (PDF)
Package/Case: BGA
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 2,688 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC7K70T-1FBG676C General Description
No. Of Logic Blocks:10250; No. Of Macrocells:65600; Fpga Family:Kintex-7; Logic Case Style:Fcbga; No. Of Pins:676Pins; No. Of Speed Grades:1; Total Ram Bits:4860Kbit; No. Of I/O S:200I/O S; Clock Management:Mmcm, Pll; Msl:- Rohs Compliant: Yes |Amd Xilinx XC7K70T-1FBG676C.
Features
IC FPGA 300 I/O 676FCBGAIC FPGA 300 I/O 676FCBGASpecifications
Parameter | Value | Parameter | Value |
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Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
Series | XC7K70T | Number of Logic Elements | 65600 LE |
Adaptive Logic Modules - ALMs | 10250 ALM | Embedded Memory | 4.75 Mbit |
Number of I/Os | 300 I/O | Supply Voltage - Min | 970 mV |
Supply Voltage - Max | 1.03 V | Minimum Operating Temperature | 0 C |
Maximum Operating Temperature | + 85 C | Data Rate | 12.5 Gb/s |
Number of Transceivers | 8 Transceiver | Mounting Style | SMD/SMT |
Package / Case | FCBGA-676 | Brand | Xilinx |
Distributed RAM | 838 kbit | Embedded Block RAM - EBR | 4860 kbit |
Maximum Operating Frequency | 640 MHz | Moisture Sensitive | Yes |
Number of Logic Array Blocks - LABs | 5125 LAB | Operating Supply Voltage | 1.2 V to 3.3 V |
Product Type | FPGA - Field Programmable Gate Array | Factory Pack Quantity | 1 |
Subcategory | Programmable Logic ICs | Tradename | Kintex |
Unit Weight | 3.460235 oz |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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XC7K70T-1FBG676C is a programmable integrated circuit, specifically a field-programmable gate array (FPGA). It belongs to the Xilinx Kintex-7 family. This chip offers a high level of logic capacity, I/O capabilities, and performance for various applications such as high-speed data processing, communication systems, and digital signal processing. With its 1FBG676C package, it provides a high pin count and ease of integration into FPGA-based designs.
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Equivalent
XC7K70T-1FBG676C is an FPGA chip from Xilinx. Equivalent products from the same series include XC7K70T-1FBG484C, XC7K70T-2FBG484C, and XC7K70T-3FBG676C. These are different variants of the same chip with varying specifications, such as number of logic cells and I/O pins, but they belong to the same Xilinx Kintex-7 family. -
Features
The XC7K70T-1FBG676C is an integrated circuit from the Xilinx Kintex-7 FPGA family. It has a package type of FBG676 and contains 70,160 logic cells, 2,160 Kbits of block RAM, and 208 DSP slices. The device operates at a speed grade of -1 and has 676 pins. -
Pinout
The XC7K70T-1FBG676C is a field-programmable gate array (FPGA) from the Xilinx Kintex-7 series. It has a pin count of 676 and is in a Fine Ball Grid Array (FBGA) package. The specific functions of the pins on this device can be obtained from the device datasheet for detailed information. -
Manufacturer
The manufacturer of the XC7K70T-1FBG676C is Xilinx. Xilinx is a technology company specializing in the design and manufacture of semiconductor devices, particularly programmable logic devices (PLD) and field-programmable gate arrays (FPGA). They provide advanced solutions for a wide range of industries including aerospace, automotive, telecommunications, and more. -
Application Field
The XC7K70T-1FBG676C is a field-programmable gate array (FPGA) designed for high-performance applications such as communications, aerospace, and defense. It can be used in various areas including signal processing, image and video processing, networking, and data storage, due to its versatile and powerful capabilities. -
Package
The XC7K70T-1FBG676C chip has a package type of FBG676, which stands for Fine-pitch Ball Grid Array with 676 balls. The form of the chip is known as 1 and its size is K70T.
Datasheet PDF
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