Xilinx XC5VLX30-1FFG324C

Part points

• The XC5VLX30-1FFG324C chip is a field-programmable gate array (FPGA) device manufactured by Xilinx. It belongs to the Virtex-5 LX Family and features 30,000 logic cells, as well as other resources such as block RAM and DSP slices. The "1FFG324C" designation refers to its package type and specific features. This chip offers programmable logic capabilities for various applications in industries like telecommunications, automotive, and aerospace.

• Equivalent

  There are no direct equivalent products to the XC5VLX30-1FFG324C chip. However, other alternatives in the Virtex-5 LX FPGA family, such as the XC5VLX30T-1FF665C or XC5VLX30T-1FFG665C, may serve as similar alternatives, offering comparable features and performance.

• Features

  The XC5VLX30-1FFG324C is an FPGA (Field Programmable Gate Array) chip with 30,240 logic cells and 1,019,520 flip-flops. It operates at a maximum frequency of 550 MHz and supports various interfaces like PCIe, Ethernet, and USB. It also has embedded RAM and DSP slices for advanced processing capabilities.

• Pinout

  The XC5VLX30-1FFG324C is a field-programmable gate array (FPGA) with a pin count of 324. It is designed for high-performance applications and offers a variety of configurable logic elements, built-in digital signal processing capabilities, and embedded hard IP cores.

• Manufacturer

  Xilinx is the manufacturer of the XC5VLX30-1FFG324C. Xilinx is a multinational technology company that specializes in the design and production of programmable logic devices and associated software development tools. They are known for their field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs).

• Application Field

  The XC5VLX30-1FFG324C is a Field-Programmable Gate Array (FPGA) that can be used in various application areas including telecommunications, video and image processing, aerospace, medical devices, and industrial automation. It provides a flexible and reconfigurable platform for implementing complex digital systems and algorithms.

• Package

  The XC5VLX30-1FFG324C chip has a package type of flip-chip, a form factor of 324-ball grid array (BGA), and a size of 23 mm x 23 mm.