Xilinx XC7K325T-2FFG900C

Part points

• The XC7K325T-2FFG900C chip is a Field-Programmable Gate Array (FPGA) from Xilinx with 325,000 logic cells and 1,200 DSP slices. It offers high performance and flexibility for a variety of applications including telecommunications, industrial automation, and automotive. The chip is designed to meet the demands of complex and compute-intensive tasks.

• Equivalent

  Some equivalent products of XC7K325T-2FFG900C chip are XC7K355T-2FFG900C, XC7K410T-2FFG900C, XC7K325T-2FFG900E, and XC7K325T-3FFG900C. These chips belong to the same Xilinx Kintex-7 FPGA family and have similar features and specifications.

• Features

  1. Xilinx Kintex-7 FPGA with 325k Logic Cells 2. 831 I/O pins 3. 40 SelectIO channels 4. 97,680 LUTs, 195,360 Flip-Flops 5. 648 KB Block RAM 6. 740 DSP slices 7. 6 GTX transceivers with 12.5 Gb/s data rate 8. Dual-core ARM Cortex-A9 processor 9. 900-pin FCBGA package

• Pinout

  The XC7K325T-2FFG900C is a field-programmable gate array (FPGA) with 900 pins. It features a capacity of 325,200 logic cells and is designed for high-performance applications such as communications and data processing.

• Manufacturer

  The XC7K325T-2FFG900C is manufactured by Xilinx, Inc. Xilinx is an American semiconductor company known for its development of field-programmable gate arrays (FPGAs) and other programmable logic devices. They are a major player in the semiconductor industry and are headquartered in San Jose, California.

• Application Field

  The XC7K325T-2FFG900C is commonly used in high-performance applications such as communication systems, industrial automation, automotive electronics, and defense applications. Its high capacity and performance characteristics make it suitable for complex digital signal processing, data processing, and high-speed connectivity requirements.

• Package

  The XC7K325T-2FFG900C chip comes in a flip-chip ball grid array (FFG) package, with a size of 900-ball and a form factor of 29x29mm.