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Xilinx XC6SLX16-2FTG256C

Name: XC6SLX16-2FTG256C
Rating: 4.5 (10 reviews)

The XC6SLX16-2FTG256C is a field-programmable gate array (FPGA) chip from Xilinx

Brands: Amd

Mfr.Part #: XC6SLX16-2FTG256C

Datasheet: XC6SLX16-2FTG256C Datasheet (PDF)

Package/Case: FBGA-256

RoHS Status:

Stock Condition: 8826 pcs, New Original

Product Type: FPGA - Field Programmable Gate Array

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty	Unit Price	Ext Price
1	$6.542	$6.542
10	$6.225	$62.250
30	$6.032	$180.960
90	$5.872	$528.480

In Stock:8826 PCS

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Remark

XC6SLX16-2FTG256C General Description

The XC6SLX16-2FTG256C is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It belongs to the Spartan-6 family and features a capacity of 1,600 logic cells. The device comes in a FTG256 package, which refers to a Fine-pitch Ball Grid Array with 256 balls.This FPGA offers various features such as 16 configurable I/O pins, 112 user I/Os, and 8 dedicated clock management tiles. It also includes 504 Kb of block RAM, making it suitable for low- to mid-range applications that require moderate logic resources.The XC6SLX16-2FTG256C operates on a supply voltage range of 1.14V to 1.26V and has a maximum operating frequency of 450 MHz. It supports various programming interfaces such as JTAG and SelectMap. Additionally, it is RoHS compliant, ensuring environmental friendliness.

Features

XC6SLX16-2FTG256C is a Field Programmable Gate Array (FPGA)
It has a package type of FTG256
Contains 16,192 logic cells and 1,548 Kbits of block RAM
Offers 16 DSP slices and 90 user I/Os
Operates at a maximum clock frequency of 405 MHz

Application

Industrial automation
Communications
Video and image processing
Medical devices
Defense and aerospace systems
Automotive electronics
Test and measurement equipment
Consumer electronics
Networking equipment
Security systems

Specifications

Parameter	Value	Parameter	Value
Product Category	FPGA - Field Programmable Gate Array	RoHS	Details
Series	XC6SLX16	Number of Logic Elements	14579 LE
Adaptive Logic Modules - ALMs	2278 ALM	Embedded Memory	576 kbit
Number of I/Os	186 I/O	Supply Voltage - Min	1.14 V
Supply Voltage - Max	1.26 V	Minimum Operating Temperature	0 C
Maximum Operating Temperature	+ 85 C	Mounting Style	SMD/SMT
Package / Case	FBGA-256	Brand	AMD / Xilinx
Distributed RAM	136 kbit	Embedded Block RAM - EBR	576 kbit
Maximum Operating Frequency	1.08 GHz	Moisture Sensitive	Yes
Number of Logic Array Blocks - LABs	1139 LAB	Operating Supply Voltage	1.2 V
Product Type	FPGA - Field Programmable Gate Array	Factory Pack Quantity	1
Subcategory	Programmable Logic ICs	Tradename	Spartan
Unit Weight	0.238217 oz

Shipping

	Ship Fee	Lead Time
DHL	$20.00-$40.00 (0.50 KG)	2-5 days
Fedex	$20.00-$40.00 (0.50 KG)	2-5 days
UPS	$20.00-$40.00 (0.50 KG)	2-5 days
TNT	$20.00-$40.00 (0.50 KG)	2-5 days
EMS	$20.00-$40.00 (0.50 KG)	2-5 days
REGISTERED AIR MAIL	$20.00-$40.00 (0.50 KG)	2-5 days

Processing Time：Shipping fee depend on different zone and country.

Payment

Terms of payment		Hand Fee
	Wire Transfer	charge US$30.00 banking fee.
	Paypal	charge 4.0% service fee.
	Credit Card	charge 3.5% service fee.
	Western Union	charge US.00 banking fee.
	Money Gram	charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

Step1 :Product
Step2 :Vacuum packaging
Step3 :Anti-static bag
Step4 :Individual packaging
Step5 :Packaging boxes
Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

Part points

The XC6SLX16-2FTG256C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It features 16,000 logic cells, 352KB of block RAM, and 16 DSP slices. It is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package and is suitable for various applications requiring high-performance reconfigurable logic.
Equivalent

Equivalent products of XC6SLX16-2FTG256C chip include XC6SLX16-2CPG196, XC6SLX16-2CSG225, and XC6SLX16-2PQG100. These chips are from the same Spartan-6 family, offer similar features and capabilities, and can be used as alternatives in designs requiring FPGA solutions.
Features

XC6SLX16-2FTG256C is a Spartan-6 FPGA by Xilinx with 16,192 logic cells, 192 logic elements, 2,800 slices, and 80 I/O. It features 16 multipliers, 48 DSP slices, and 275Kb Block RAM. It operates at a maximum frequency of 400MHz, making it suitable for low-power applications that require programmable logic.
Pinout

The XC6SLX16-2FTG256C is a field-programmable gate array (FPGA) with a pin count of 256 in a FTG256 package. This device features 16,000 logic cells, 280 Kbits of block RAM, and 384 user I/Os. It is suitable for applications requiring moderate logic capacity and I/O capabilities.
Manufacturer

The XC6SLX16-2FTG256C is manufactured by Xilinx, Inc., which is an American technology company specializing in programmable logic devices, software development tools, and IP cores. Xilinx is known for its FPGA (Field Programmable Gate Array) products and is a leading player in the semiconductor industry.
Application Field

The XC6SLX16-2FTG256C is commonly used in applications such as industrial automation, automotive, telecommunications, and medical devices. It is suitable for use in embedded systems, signal processing, data encryption, and high-speed communication systems due to its low power consumption and high performance capabilities.
Package

The XC6SLX16-2FTG256C chip comes in a Flip Chip Ball Grid Array (FCBGA) package, with a 15mm x 15mm size and a 256-pin count.

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