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Xilinx XC7A200T-2FBG676C 48HRS

Commercial Grade RoHS compliant for environmentally-friendly operation

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC7A200T-2FBG676C

Datasheet: XC7A200T-2FBG676C Datasheet (PDF)

Package/Case: FCBGA-676

RoHS Status:

Stock Condition: 9,533 pcs, New Original

Product Type: FPGAs (Field Programmable Gate Array)

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $36.550 $36.550

In Stock: 9,533 PCS

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Quick Quote

Please submit RFQ for XC7A200T-2FBG676C or email to us: Email: [email protected], we will contact you within 12 hours.

XC7A200T-2FBG676C General Description

The XC7A200T-2FBG676C is a member of the Xilinx Artix-7 family of field-programmable gate arrays (FPGAs). This specific model features a hefty 215,360 Logic Cells, making it one of the largest FPGAs in the Artix-7 lineup. It also boasts 13,300 slices, 520 DSP slices, and 830KB of block RAM.This FPGA comes in a BGA package with 676 pins, making it suitable for applications that require high-performance processing and large-scale integration. The XC7A200T-2FBG676C operates at a maximum speed of 667MHz and features 200 input/output pins, providing plenty of flexibility for connecting to external devices or peripherals.

Features

  • FPGA Model: XC7A200T
  • Package: FBG676C
  • Logic Cells: 215,360
  • System Logic Cells: 160,800
  • DSP Slices: 740
  • Block RAM: 44,300 Kb
  • Max CLB Flip-Flops: 1,021,440
  • Max Distributed RAM: 10,400 Kb
  • Application

  • High-performance computing
  • Data center applications
  • Industrial automation
  • Medical imaging
  • Aerospace and defense
  • Automotive
  • Networking and telecommunications
  • Wireless communication systems
  • Video processing and broadcasting
  • 0. Robotics and machine vision
  • Specifications

    Parameter Value Parameter Value
    Product Category FPGA - Field Programmable Gate Array RoHS Details
    Series XC7A200T Number of Logic Elements 215360 LE
    Adaptive Logic Modules - ALMs 33650 ALM Embedded Memory 12.83 Mbit
    Number of I/Os 400 I/O Supply Voltage - Min 950 mV
    Supply Voltage - Max 1.05 V Minimum Operating Temperature 0 C
    Maximum Operating Temperature + 85 C Data Rate 6.6 Gb/s
    Number of Transceivers 8 Transceiver Mounting Style SMD/SMT
    Package / Case FCBGA-676 Brand AMD / Xilinx
    Distributed RAM 2888 kbit Embedded Block RAM - EBR 13140 kbit
    Moisture Sensitive Yes Number of Logic Array Blocks - LABs 16825 LAB
    Operating Supply Voltage 1 V Product Type FPGA - Field Programmable Gate Array
    Factory Pack Quantity 1 Subcategory Programmable Logic ICs
    Tradename Artix

    Shipping

    Shipping Type Ship Fee Lead Time
    DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
    Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
    UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
    TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
    EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
    REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

    Processing Time:Shipping fee depend on different zone and country.

    Payment

    Terms of payment Hand Fee
    Wire Transfer Wire Transfer charge US$30.00 banking fee.
    Paypal Paypal charge 4.0% service fee.
    Credit Card Credit Card charge 3.5% service fee.
    Western Union Western Union charge US.00 banking fee.
    Money Gram Money Gram charge US$0.00 banking fee.

    Guarantees

    1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

    2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

    Packing

    • Product

      Step1 :Product

    • Vacuum packaging

      Step2 :Vacuum packaging

    • Anti-static bag

      Step3 :Anti-static bag

    • Individual packaging

      Step4 :Individual packaging

    • Packaging boxes

      Step5 :Packaging boxes

    • bar-code shipping tag

      Step6 :bar-code shipping tag

    All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

    Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

    We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

    After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

    • ESD
    • ESD

    Part points

    • The XC7A200T-2FBG676C is a high-performance field-programmable gate array (FPGA) chip from Xilinx. It features 215,360 logic cells and 1,100,000 system gates, making it suitable for demanding applications such as telecommunications, aerospace, and industrial automation. With a maximum operating frequency of 600 MHz, this chip offers high-speed processing capabilities for complex designs.
    • Equivalent

      Some equivalent products of XC7A200T-2FBG676C chip are XC7A200T-3FBG676C, XC7A200T-1SBG676C, and XC7A200T-2SBG676C. These chips are part of the Xilinx 7 Series FPGA family and offer similar features and performance capabilities.
    • Features

      XC7A200T-2FBG676C is an FPGA device from Xilinx with 215,360 logic cells, 13,300 slices, and 56 Mb of RAM. It features 4,020 DSP slices, 80 3.75 Gbps transceivers, and advanced connectivity options like PCIe, Gigabit Ethernet, and DDR3 memory interfaces. It supports a wide range of applications requiring high performance and flexibility.
    • Pinout

      The XC7A200T-2FBG676C is a Field Programmable Gate Array (FPGA) with 676 pins in a FBGA package. It is part of the Xilinx Artix-7 family and has 215,360 logic cells. It is designed for high-performance applications in various industries.
    • Manufacturer

      XC7A200T-2FBG676C is manufactured by Xilinx, which is an American company specializing in designing and manufacturing programmable logic devices, including field-programmable gate arrays (FPGAs). Xilinx is a leading provider of advanced semiconductor technologies and platforms used in various applications such as 5G networking, automotive, aerospace, and data centers.
    • Application Field

      Some application areas of XC7A200T-2FBG676C include high-performance computing, telecommunications, networking, automotive, industrial automation, and medical devices. It is commonly used in applications requiring high processing power, high-speed interfaces, and low power consumption.
    • Package

      The XC7A200T-2FBG676C chip is a Field Programmable Gate Array (FPGA) in a Ball Grid Array (BGA) package with 676 pins. It measures 27x27mm in size.

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