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Xilinx XC7Z015-2CLG485I
XC7Z015-2CLG485I SoC FPGA
Brands: Amd
Mfr.Part #: XC7Z015-2CLG485I
Datasheet: XC7Z015-2CLG485I Datasheet (PDF)
Package/Case: CSBGA-485
RoHS Status:
Stock Condition: 3,979 pcs, New Original
Product Type: System On Chip (SoC)
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $30.951 | $30.951 |
| 3 | $27.736 | $83.208 |
| 30 | $26.530 | $795.900 |
In Stock: 3,979 PCS
XC7Z015-2CLG485I General Description
The XC7Z015-2CLG485I is a member of the Xilinx Zynq-7000 family of SoCs (System on Chips). It features a dual-core ARM Cortex-A9 processor with programmable logic fabric, making it suitable for a wide range of embedded applications requiring both processing power and flexibility.This particular model is designed for industrial-grade applications, with a maximum operating temperature of -40°C to 100°C. It has a total of 53,200 logic cells and 85,600 lookup tables, providing ample resources for implementing custom logic functions.The device includes 256 KB of on-chip memory, as well as 512 KB of BRAM (Block RAM) for data storage. It also features multiple communication interfaces, including Gigabit Ethernet, USB, CAN, SPI, and I2C, allowing for easy integration with other systems.The XC7Z015-2CLG485I comes in a 485-pin package and operates at a core voltage of 0.95V, making it energy-efficient. It also supports various power-saving modes, helping to prolong battery life in portable devices.
Features
- Dual-core ARM Cortex-A9 processor
- 28,000 logic cells and 240 DSP slices
- 512 MB DDR3 SDRAM
- 10/100/1000 Ethernet MAC
- USB 2.0, SD/SDIO, CAN, and I2C interfaces
- Programmable Logic cells for custom IP integration
- 485-pin footprint
Application
- Industrial automation
- Communications systems
- Medical imaging equipment
- Video processing applications
- Test and measurement equipment
- High-performance computing
- Automotive electronics
- Security and surveillance systems
- Aerospace and defense
- Internet of Things (IoT) devices
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | SoC FPGA | RoHS | Details |
| Mounting Style | SMD/SMT | Package / Case | CSBGA-485 |
| Core | ARM Cortex A9 | Number of Cores | 2 Core |
| Maximum Clock Frequency | 766 MHz | L1 Cache Instruction Memory | 2 x 32 kB |
| L1 Cache Data Memory | 2 x 32 kB | Number of Logic Elements | 74000 LE |
| Adaptive Logic Modules - ALMs | 11550 ALM | Embedded Memory | 3.3 Mbit |
| Number of I/Os | 150 I/O | Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 100 C | Brand | AMD / Xilinx |
| Moisture Sensitive | Yes | Number of Logic Array Blocks - LABs | 5775 LAB |
| Product Type | Processors - Application Specialized | Series | XC7Z015 |
| Factory Pack Quantity | 1 | Subcategory | SOC - Systems on a Chip |
| Tradename | Zynq |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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XC7Z015-2CLG485I is a chip from the XC7Z015 series by Xilinx. It is a System-on-Chip (SoC) device that integrates a high-performance processor and programmable logic fabric on a single chip. It features a dual-core ARM Cortex-A9 processor and is ideal for applications requiring high processing and programmable logic capabilities. The CLG485I package refers to the chip's specific packaging and pin configuration.
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Equivalent
The equivalent products of the XC7Z015-2CLG485I chip are the XC7Z014-2CLG485I chip, which has a slightly lower capacity, and the XC7Z016-2CLG485I chip, which has a slightly higher capacity. -
Features
The XC7Z015-2CLG485I is a system-on-chip (SoC) device with 28,000 logic cells, 5850 slices, and 220 DSP slices. It features a dual-core ARM Cortex-A9 processor, programmable logic, and various I/O interfaces. It has an I/O voltage range of 1.8V to 3.3V and offers high-performance processing capabilities, making it suitable for a wide range of applications. -
Pinout
The XC7Z015-2CLG485I is a 485-ball, flip-chip ball grid array (FCBGA) package. It has a total of 485 pins, which are used for various functions such as power supply, data input/output, clock signals, and configuration. -
Manufacturer
The XC7Z015-2CLG485I is manufactured by Xilinx Inc., an American technology company specializing in programmable logic devices and associated software development tools. It is a semiconductor company that produces versatile and adaptable products for a variety of industries such as automotive, aerospace, telecommunications, and consumer electronics. -
Application Field
The XC7Z015-2CLG485I is a versatile system on a chip (SoC) that can be used in a wide range of application areas such as industrial automation, aerospace and defense, telecommunications, medical devices, and automotive electronics. Its advanced capabilities, including high-performance processing, embedded memory, and programmable logic, make it suitable for various embedded applications requiring efficient and flexible processing capabilities. -
Package
The XC7Z015-2CLG485I chip is packaged in a 485-pin, plastic, flip-chip BGA (Ball Grid Array) package. The form factor is compact, with dimensions of approximately 23 x 23 mm.
Datasheet PDF
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