Xilinx XC7S75-2FGGA676C

Part points

• The XC7S75-2FGGA676C is a high-performance Field Programmable Gate Array (FPGA) chip from Xilinx. It features a Spartan-7 FPGA architecture with 75,000 logic cells and 1800 Kb of Block RAM. This chip is designed for use in a wide range of applications including networking, industrial automation, and telecommunications.

• Equivalent

  Some equivalent products of XC7S75-2FGGA676C chip are XC7S75-2FGGA676E, XC7S75-2FGGA676I, and XC7S75-2FGGA676M. These chips belong to the same Spartan-7 FPGA series and offer similar functionalities and performance characteristics.

• Features

  The XC7S75-2FGGA676C is a Spartan-7 FPGA with 75,000 logic cells, 1,200 Kbits of block RAM, 176 DSP slices, and 180 available I/O pins. It operates at a maximum speed of 450 MHz, and has integrated features such as PLLs, memory controllers, and configurable logic blocks.

• Pinout

  The XC7S75-2FGGA676C is a Spartan-7 FPGA with 676 pins. It offers a wide range of features such as programmable logic cells, Block RAM, DSP slices, and configuration memory. Additionally, it supports advanced interfaces such as PCIe, Gigabit Ethernet, and DDR3 memory.

• Manufacturer

  The manufacturer of XC7S75-2FGGA676C is Xilinx, Inc. Xilinx is a technology company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs). They are known for their high-performance and advanced semiconductor solutions utilized in a variety of industries such as telecommunications, automotive, aerospace, and defense.

• Application Field

  XC7S75-2FGGA676C is commonly used in applications such as aerospace and defense, communications, automotive, industrial automation, and consumer electronics. Its high processing power, flexibility, and ability to handle complex algorithms make it suitable for a wide range of applications requiring advanced signal processing and high-performance computing capabilities.

• Package

  The XC7S75-2FGGA676C chip is in a 676-pin FBGA (Fine-Pitch Ball Grid Array) package. The chip is available in the form of a silicon die housed inside the package. The package dimensions are typically around 27mm x 27mm.