Xilinx XC7Z010-1CLG225C
IC SOC CORTEX-A9 ARTIX-7 225BGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7Z010-1CLG225C
Datasheet: XC7Z010-1CLG225C Datasheet (PDF)
Package/Case: BGA225
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2895 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7Z010-1CLG225C General Description
Psoc, Arm Cortex-A9, 667Mhz, Csbga-225; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Csbga; No. Of Pins:225Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z010-1CLG225C
Features
IC SOC CORTEX-A9 ARTIX-7 225BGAIC SOC CORTEX-A9 ARTIX-7 225BGASpecifications
Parameter | Value | Parameter | Value |
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Pin Count | 225 | Package Category | BGA |
Released Date | Aug 21, 2016 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7Z010-1CLG225C chip is a system-on-chip (SoC) device designed for embedded processing and applications requiring high processing power. It is part of the Xilinx Zynq-7000 family and integrates a dual-core ARM Cortex-A9 processor with Xilinx programmable logic technology. The chip offers a range of features like high-speed connectivity, high-performance signal processing, and programmable logic flexibility, making it suitable for various applications such as industrial automation, automotive, and aerospace.
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Equivalent
XC7Z020-1CLG225C and XC7Z030-1CLG225C are equivalent products to the XC7Z010-1CLG225C chip. -
Features
XC7Z010-1CLG225C is a member of the Xilinx Zynq-7000 family. It is a System-on-Chip (SoC) that combines an ARM Cortex-A9 processor and programmable logic, with 28,000 logic cells, in a single device. It offers a range of features, including integrated memory, connectivity interfaces, and flexible programming options for various applications in automotive, industrial, and consumer electronics. -
Pinout
The XC7Z010-1CLG225C is a 225-pin BGA package FPGA with 100 user I/Os. It is a Zynq-7000 SoC from Xilinx, combining an ARM Cortex-A9 processor and programmable logic elements. -
Manufacturer
Xilinx is the manufacturer of the XC7Z010-1CLG225C. It is a semiconductor company specializing in the design and development of programmable logic devices and associated software tools. -
Application Field
The XC7Z010-1CLG225C is a field-programmable gate array (FPGA) chip commonly used in various applications such as embedded processing, industrial automation, automotive, aerospace, and defense. It offers high performance, low power consumption, and flexibility for a wide range of applications that require customizable hardware acceleration and processing capabilities. -
Package
The XC7Z010-1CLG225C chip has a BGA package type, it is in the form of a square chip, and its size is 225 grid array with a width of 17mm and a length of 17mm.
Datasheet PDF
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