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Xilinx XC7K325T-3FFG900C
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7K325T-3FFG900C
Datasheet: XC7K325T-3FFG900C Datasheet (PDF)
Package/Case: BGA900
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3035 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomOvaga has a large stock of XC7K325T-3FFG900C Programmable Logic ICs from AMD Xilinx, Inc and we guarantee that they are original,brand new parts sourced directly from AMD Xilinx, Inc We can provide quality testing reports for XC7K325T-3FFG900C upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.
Shipping
| Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7K325T-3FFG900C chip is a high-performance field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Kintex-7 family and has 325,000 logic cells along with various other features like high-speed transceivers and high-speed memory interfaces. It operates at a speed grade of -3 and comes in a flip-chip package with 900 pins. The chip is commonly used in applications that require high computing power, advanced signal processing, and high-speed data communication.
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Equivalent
There are no direct equivalent products of the XC7K325T-3FFG900C chip in terms of performance and specifications. However, similar alternatives from Xilinx include the XC7K410T-3FF900E and XC7K420T-3FF900E chips, which have higher logic capacity and can be considered as potential replacements depending on the specific application requirements. -
Features
The XC7K325T-3FFG900C is an FPGA device from Xilinx with 324,080 logic cells, 1,800 DSP slices, and 7,371Kbits of block RAM. It operates at a speed grade of -3 and has 900 fine-pitch ball grid array (FFGBA) packages. -
Pinout
The XC7K325T-3FFG900C is a Xilinx Virtex-7 FPGA with a pin count of 900 and a ball grid array package. It offers a wide range of functions for various applications such as high-performance computing, wired communication, and aerospace. -
Manufacturer
The XC7K325T-3FFG900C is manufactured by Xilinx Inc., an American technology company that specializes in the development and production of programmable logic devices and associated software tools. -
Application Field
The XC7K325T-3FFG900C is a field-programmable gate array (FPGA) primarily used for various applications such as data centers, wired communications, machine vision, and test and measurement. This high-performance device offers a wide range of functionality and flexibility for these specific areas. -
Package
The XC7K325T-3FFG900C chip is of the BGA (Ball Grid Array) package type, with a 900 ball grid array. It has a form/factor size of 39 x 39 mm².
Datasheet PDF
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