Xilinx XC7K160T-2FBG484I
FPGA - Field Programmable Gate Array XC7K160T-2FBG484I
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7K160T-2FBG484I
Datasheet: XC7K160T-2FBG484I Datasheet (PDF)
Package/Case: BGA-484
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3940 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7K160T-2FBG484I General Description
Fpga, Kintex-7 , 185 I/O, Fcbga-484; No. Of Logic Blocks:25350; No. Of Macrocells:162240; Fpga Family:Kintex-7; Logic Case Style:Fcbga; No. Of Pins:484Pins; No. Of Speed Grades:2; Total Ram Bits:11700Kbit; No. Of I/O S:185I/O S; Rohs Compliant: Yes |Amd Xilinx XC7K160T-2FBG484I
Features
- 160,000 logic cells
- 12.5 Gb/s transceivers
- 36 Mb of distributed memory
- 560 DSP slices
- 1,000+ user I/Os
- 2.5 GHz maximum frequency
Application
- High-performance computing
- Video processing and display
- Aerospace and defense systems
- Industrial control and automation
- Medical imaging
- Wired and wireless communications
Specifications
Parameter | Value | Parameter | Value |
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Pin Count | 484 | Package Category | BGA |
Released Date | Dec 1, 2019 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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XC7K160T-2FBG484I is a high-performance FPGA chip from Xilinx. It belongs to the Kintex-7 family and has a capacity of 160,000 logic cells. The chip is designed to offer advanced processing capabilities and high-speed performance, making it suitable for a wide range of applications including telecommunications, industrial automation, and medical equipment.
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Features
Features of the XC7K160T-2FBG484I include a 160,000 logic cell capacity, 4 input-output banks, high-speed serial transceivers, multiple memory interfaces, programmable I/O standards, built-in power management, and a versatile integrated development environment for FPGA design. -
Pinout
The XC7K160T-2FBG484I is a FPGA device. It has 484 pins and is part of the Xilinx Kintex-7 family. The specific functions and capabilities of this device would require additional information or reference to its datasheet for a more detailed explanation. -
Manufacturer
Xilinx is the manufacturer of the XC7K160T-2FBG484I. They are a technology company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs). -
Application Field
The XC7K160T-2FBG484I is a field-programmable gate array (FPGA) that can be used in a variety of applications including aerospace and defense, automotive, consumer electronics, and wired communication. It offers high-speed processing, low power consumption, and flexible programmability, making it suitable for a wide range of demanding applications. -
Package
The XC7K160T-2FBG484I chip has a package type of FBGA (Fine-pitch Ball Grid Array), a form factor of BGA (Ball Grid Array), and a size of 484 pins with a pitch of 1 mm.
Datasheet PDF
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