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Xilinx XC7A200T-3FBG676E
Artix-7 FPGA, 400 User I/Os, 8 GTP, 676-Ball BGA, Speed Grade 3, Extended Grade, FBG676, RoHS
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7A200T-3FBG676E
Datasheet: XC7A200T-3FBG676E Datasheet (PDF)
Package/Case: FCBGA676
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2894 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7A200T-3FBG676E General Description
Fpga, Artix-7, 400 I/O, Fcbga-676; No. Of Logic Blocks:33650; No. Of Macrocells:215360; Fpga Family:Artix-7; Logic Case Style:Fcbga; No. Of Pins:676Pins; No. Of Speed Grades:3; Total Ram Bits:13140Kbit; No. Of I/O S:400I/O S; Clock Rohs Compliant: Yes |Amd Xilinx XC7A200T-3FBG676E
Features
IC FPGA ARTIX7 400 I/O 676FCBGAIC FPGA ARTIX7 400 I/O 676FCBGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Case/Package | FCBGA | Max Operating Temperature | 100 °C |
| Min Operating Temperature | 0 °C | Number of ADC Channels | 1 |
| Number of I/Os | 400 | Number of Logic Blocks (LABs) | 16825 |
| Number of Logic Elements/Cells | 215360 | Number of Registers | 269200 |
| Number of Transceivers | 8 | Operating Supply Voltage | 1 V |
| Propagation Delay | 110 ps | RAM Size | 1.6 MB |
| Speed Grade | -3 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7A200T-3FBG676E chip is a member of the Artix-7 FPGA family by Xilinx. It offers a range of programmable logic capabilities, making it suitable for various applications. This chip has a capacity of 215,360 logic cells, 95,040 flip-flops, and 740 DSP slices. It features a FBG676 package and operates at a speed grade of -3.
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Equivalent
Some equivalent products to the XC7A200T-3FBG676E chip are the XC7A200T-2FBG676I, XC7A200T-3FBG484E, and XC7A200T-3SBG484C chips. -
Features
The XC7A200T-3FBG676E is a Xilinx FPGA with 215,360 logic cells, 2,585 DSP slices, and 31 Mbit of BRAM. It features a 500 MHz clock frequency, multiple I/O standards, and supports various system-level functions such as PCIe and Ethernet. It comes in a 676-pin package with a FBG packaging. -
Pinout
The XC7A200T-3FBG676E is an FPGA (Field-Programmable Gate Array) device with 676 pins. The exact pin functions will depend on the specific design being implemented on the FPGA, as the device can be customized and programmed to perform various functions. -
Manufacturer
The manufacturer of the XC7A200T-3FBG676E is Xilinx Inc. It is an American technology company that specializes in the design and manufacture of programmable logic devices, including field-programmable gate arrays (FPGAs). Xilinx is known for its innovative solutions in the field of integrated circuits and is one of the industry leaders in FPGA technology. -
Application Field
The XC7A200T-3FBG676E is an FPGA chip primarily used in areas such as wireless communication, automotive electronics, industrial control systems, and high-performance computing. It is designed to provide high processing power, low power consumption, and flexibility for a wide range of applications. -
Package
The XC7A200T-3FBG676E chip has a package type of Ball Grid Array (BGA), a form factor of 676-FBGA, and a size of 27 mm x 27 mm.
Datasheet PDF
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