Xilinx XC7VX690T-2FFG1761I
FPGA Virtex-7 XT Family 693120 Cells 28nm Technology 1V 1761-Pin FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7VX690T-2FFG1761I
Datasheet: XC7VX690T-2FFG1761I Datasheet (PDF)
Package/Case: 1761-FCBGA
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3965 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7VX690T-2FFG1761I General Description
Fpga, Virtex-7, 850 I/O, Fcbga-1761; No. Of Logic Blocks:108300; No. Of Macrocells:693120; Fpga Family:Virtex-7; Logic Case Style:Fcbga; No. Of Pins:1761Pins; No. Of Speed Grades:2; Total Ram Bits:52920Kbit; No. Of I/O S:850I/O S; Rohs Compliant: Yes |Amd Xilinx XC7VX690T-2FFG1761I
Features
IC FPGA 850 I/O 1761FCBGAIC FPGA 850 I/O 1761FCBGASpecifications
Parameter | Value | Parameter | Value |
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Pin Count | 1760 | Package Category | BGA |
Released Date | Mar 25, 2020 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7VX690T-2FFG1761I chip is a product of Xilinx, designed for advanced applications in sectors such as aerospace, defense, and high-performance computing. It is a high-capacity field-programmable gate array (FPGA) with 2 million logic cells, high-speed transceivers, and advanced DSP capabilities. It offers exceptional processing power, flexibility, and scalability, making it suitable for demanding and complex tasks.
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Features
The XC7VX690T-2FFG1761I is a Xilinx Virtex-7 Field-Programmable Gate Array (FPGA). It features 690,000 logic cells, 1,120 DSP slices, 52 Mb of BRAM, 32.5 Gbps transceivers, and supports various interfaces like PCIe, Ethernet, and DDR3. It offers high-performance processing and is ideal for applications such as aerospace, medical imaging, and video processing. -
Pinout
The XC7VX690T-2FFG1761I is an FPGA with 1761 pins. The pin count refers to the number of external connections available on the device. The specific functions of each pin can vary depending on the design implementation. -
Manufacturer
The manufacturer of the XC7VX690T-2FFG1761I is Xilinx Inc. Xilinx is a technology company specializing in the development and production of programmed logic devices and associated software tools. They are known for their industry-leading field-programmable gate arrays (FPGAs) and programmable systems-on-chips (SoCs). -
Application Field
The XC7VX690T-2FFG1761I, belonging to the Virtex-7 family of Field Programmable Gate Arrays (FPGAs) offered by Xilinx, has various application areas. It can be used in industries like telecommunications, automotive, aerospace, and defense for tasks such as signal processing, high-performance computing, system acceleration, and high-speed networking, among others. -
Package
The XC7VX690T-2FFG1761I chip has a package type of Flip Chip Fine-Pitch Ball Grid Array (FC FBGA), a form factor of 1761-ball and a package size of 31mm x 31mm.
Datasheet PDF
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