Xilinx XC7S75-2FGGA484I

Part points

• The XC7S75-2FGGA484I is a high-performance Field-Programmable Gate Array (FPGA) chip from Xilinx. It features a 75K logic cell capacity and a 484-pin fine-pitch Ball Grid Array (BGA) package. This chip offers high-speed processing and programmable flexibility for a wide range of applications, including telecommunications, industrial automation, and aerospace.

• Equivalent

  The equivalent products of XC7S75-2FGGA484I chip are Kintex-7 XC7K160T-2FBG484C and Virtex-6 XC6VSX315T-2FFG1156C chips.

• Features

  XC7S75-2FGGA484I is a Xilinx Spartan-7 FPGA with 75K logic cells, 2400 kbits of block RAM, 160 DSP slices, and 4 PCIe lanes. It operates at a maximum frequency of 450 MHz and supports various IO standards like LVCMOS, LVDS, and SSTL. It is suitable for applications requiring moderate logic capacity and high-speed processing.

• Pinout

  The XC7S75-2FGGA484I is a 484-pin FPGA (Field Programmable Gate Array) semiconductor device from Xilinx. It has a 75,000 logic cell count and is part of the Spartan-7 series. The device is designed for high performance applications requiring programmable logic and digital signal processing capabilities.

• Manufacturer

  XC7S75-2FGGA484I is manufactured by Xilinx, an American technology company known for producing programmable logic devices, software development tools, and IP cores for the semiconductor industry. Xilinx is a leading provider of FPGA solutions for a wide range of industries, including aerospace, automotive, telecommunications, and consumer electronics.

• Application Field

  The XC7S75-2FGGA484I is commonly used in various applications including aerospace, automotive, industrial, telecommunications, and consumer electronics. It is suitable for high-performance applications requiring programmable logic and signal processing capabilities. It is often used in data processing, image processing, robotic control, and digital communications systems.

• Package

  The XC7S75-2FGGA484I chip is a Field-Programmable Gate Array (FPGA) in the 484-pin Fine-Pitch Ball Grid Array (FGGA) package. It has a form factor of 17mm x 17mm and a size of 20 x 20 grid of 0.8mm pitch balls.