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Infineon BSM75GB170DN2

IGBT Modules N-CH 1.7KV 110A

ISO14001 ISO9001 DUNS

Brands: Infineon

Mfr.Part #: BSM75GB170DN2

Datasheet: BSM75GB170DN2 Datasheet (PDF)

Package/Case: 32 mm

Product Type: IGBT Modules

RoHS Status:

Stock Condition: 9458 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for BSM75GB170DN2 or email to us: Email: [email protected], we will contact you within 12 hours.

Ovaga has a large stock of BSM75GB170DN2 IGBT Modules from Infineon and we guarantee that they are original,brand new parts sourced directly from Infineon We can provide quality testing reports for BSM75GB170DN2 upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.

Specifications

Parameter Value Parameter Value
Product Category IGBT Modules RoHS Details
Product IGBT Silicon Modules Configuration Dual
Collector- Emitter Voltage VCEO Max 1.7 kV Continuous Collector Current at 25 C 110 A
Package / Case 32 mm Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 150 C Brand Infineon Technologies
Height 30.5 mm Length 94 mm
Maximum Gate Emitter Voltage 20 V Mounting Style Chassis Mount
Product Type IGBT Modules Factory Pack Quantity 10
Subcategory IGBTs Technology Si
Width 34 mm Part # Aliases SP000100464 BSM75GB170DN2HOSA1
Unit Weight 8.818490 oz

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The BSM75GB170DN2 is a power module chip designed for applications requiring high power and efficiency. It features a voltage rating of 1700V and a current rating of 75A, making it suitable for various industrial and automotive applications. The chip is known for its reliability, performance, and ease of use in power electronics systems.
  • Equivalent

    The equivalent products of BSM75GB170DN2 chip are BSM75GB120DN2, BSM75GB170DN2H, BSM75GB120DN2H. These chips are part of the BSM series from ROHM Semiconductor and offer similar specifications and performance characteristics to the BSM75GB170DN2 chip.
  • Features

    BSM75GB170DN2 is an IGBT power module with a current rating of 75A and a voltage rating of 1700V. It has low switch-off losses, high short-circuit capability, and an insulated mounting baseplate. It is suitable for various industrial applications such as motor control, power supplies, and renewable energy systems.
  • Pinout

    The BSM75GB170DN2 is an IGBT module with a pin count of 7. The functions of each pin are: 1 - Collector 2 - Emitter 3 - Emitter 4 - Gate 5 - Gate 6 - Collector 7 - Emitter.
  • Manufacturer

    Infineon Technologies AG is the manufacturer of the BSM75GB170DN2. It is a German semiconductor manufacturer specializing in power semiconductors, sensors, and microcontrollers. Infineon serves various industries including automotive, industrial, and renewable energy, offering solutions for efficient energy management and increased performance.
  • Application Field

    The BSM75GB170DN2 is commonly used in applications requiring high power and efficiency such as industrial motor drives, wind turbines, and traction systems. It is also suitable for power supplies, solar inverters, and electric vehicle charging stations. Additionally, it is utilized in regenerative braking systems and grid-tie inverters for renewable energy systems.
  • Package

    The BSM75GB170DN2 is a power module with a half bridge configuration. It is in a module package with a press-fit pin type, measuring at 62mm x 43mm x 18mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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