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Infineon BSM25GP120 48HRS

IGBT Module Full Bridge 1200 V 45 A 230 W Chassis Mount Module

ISO14001 ISO9001 DUNS

Brands: Infineon

Mfr.Part #: BSM25GP120

Datasheet: BSM25GP120 Datasheet (PDF)

Package/Case: EconoPIM2

RoHS Status:

Stock Condition: 3351 pcs, New Original

Product Type: Transistors

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $265.636 $265.636
200 $102.799 $20559.800
500 $99.186 $49593.000
1000 $97.400 $97400.000

In Stock:3351 PCS

- +

Quick Quote

Please submit RFQ for BSM25GP120 or email to us: Email: [email protected], we will contact you within 12 hours.

BSM25GP120 General Description

IGBT Module Full Bridge 1200 V 45 A 230 W Chassis Mount Module

bsm25gp120

Features

  • Voltage rating: 1200V
  • Current rating: 25A
  • IGBT (Insulated Gate Bipolar Transistor) inverter
  • Fast-switching
  • Low-loss
  • High-frequency operation
  • Integrated gate driver and protection functions
  • Isolated copper baseplate for improved thermal performance
bsm25gp120

Application

  • Motor drives
  • Power supplies
  • Inverters
  • Renewable energy systems
  • Industrial automation equipment
  • UPS (Uninterruptible Power Supplies)
  • Welding equipment
  • Battery chargers

Specifications

Parameter Value Parameter Value
Product Category IGBT Modules RoHS Details
Product IGBT Silicon Modules Configuration Array 7
Collector- Emitter Voltage VCEO Max 1.6 kV Collector-Emitter Saturation Voltage 2.55 V
Continuous Collector Current at 25 C 45 A Gate-Emitter Leakage Current 300 nA
Pd - Power Dissipation 230 W Package / Case EconoPIM2
Minimum Operating Temperature - 40 C Maximum Operating Temperature + 125 C
Brand Infineon Technologies Height 17 mm
Length 107.5 mm Maximum Gate Emitter Voltage 20 V
Mounting Style Chassis Mount Product Type IGBT Modules
Factory Pack Quantity 10 Subcategory IGBTs
Technology Si Width 45 mm
Part # Aliases SP000095940 BSM25GP120BOSA1

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the BSM25GP120 component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   SKM25GB123D

Brands :  

Package :  

Description :  

Part Number :   CIPOS?

Brands :  

Package :  

Description :   Tiny 3-Phase Inverter Module: 2ED218x, IKCM10F60GA, F3L20MR07W2M1_B11, FSBS10CH60B, BSM25GD120DN2E3224

Part Number :   CIPOS?

Brands :  

Package :  

Description :   Nano 3-Phase Inverter Module: IKCM15F60GA, BSM15GD120DN2E3224, F3L15MR07W2M1_B11, FSBS15CH60B, 2ED218x

Part Number :   CIPOS?

Brands :  

Package :  

Description :   Micro 3-Phase Inverter Module: IKCM30F60GA, BSM30GD120DN2E3224, F3L30MR07W2M1_B11, FSBS30CH60B, 2ED218x

Part points

  • The BSM25GP120 is a power module designed for use in inverters, converters, and motor drives. It features a 1200V/25A IGBT module along with various protection features such as short circuit and overcurrent protection. This chip is commonly used in industrial applications for controlling and converting electric power.
  • Equivalent

    Equivalent products to the BSM25GP120 chip include SEMIX252GB12E4s, SKM200GB126D1s, and FF200R12KT3s. These chips are all IGBT modules with similar specifications and capabilities, suitable for various power electronics applications.
  • Features

    1. BSM25GP120 is a 1200V/25A IGBT module with dual high-speed IGBTs. 2. It features low VCE(sat) and low switching losses for improved efficiency. 3. It has a low thermal resistance and high thermal cycling capability. 4. The module is suitable for motor drives, inverters, and other power electronic applications.
  • Pinout

    The BSM25GP120 is a 25-pin IGBT power module. It consists of three-phase half-bridge modules with IGBTs and diodes for use in motor drives and power inverters. The pins include control, gate, emitter, collector, and heatsink connections.
  • Manufacturer

    The BSM25GP120 is manufactured by Infineon Technologies AG, a German semiconductor manufacturer specializing in power electronics, automotive, and industrial applications. They produce a wide range of products such as microcontrollers, sensors, power modules, and RF components for various industries worldwide.
  • Application Field

    The BSM25GP120 is a power module commonly used in industrial drives, renewable energy systems, and electric vehicle applications. It is specifically designed for high power density applications where efficient power conversion is critical.
  • Package

    The BSM25GP120 chip is in a module package type, with a power module form factor. It measures 30mm x 14mm in size.

Datasheet PDF

Preliminary Specification BSM25GP120 PDF Download

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