Small Outline Integrated Circuit - SOIC
Update Time: Nov 02, 2023 Readership: 901
Contents
ICs are ubiquitous, with at least one IC present in virtually every electronic product, encompassing smartphones, tablets, televisions, as well as vehicles, medical instruments, and household appliances. ICs offer versatile functionality, ranging from basic logic gates and memory storage to advanced microprocessors and communication chips, thereby delivering the essential intelligence and capabilities required for a diverse range of electronic devices. These ICs are composed of a collection of fundamental electronic components, such as capacitors, diodes, and transistors, intricately integrated into diminutive chips, enabling a high level of functional integration. The components within ICs are intricately interconnected through metal wires, electrodes, conductors, and through-holes to execute specific circuit functions, ensuring the proper coordination of various elements. ICs are available in diverse packaging types, including SOIC, SSOP, TSSOP, and more, tailored to various application requirements, where packaging formats impact the physical appearance and pin layouts.
|
Category |
Description |
|
Material |
|
|
Metal Packaging |
Packaging made of metal, typically used for high-performance applications, providing good heat dissipation and electromagnetic shielding. |
|
Ceramic Packaging |
Packaging made of ceramic material, typically used for high-temperature, high-frequency, and high-reliability applications, offering excellent heat resistance and package stability. |
|
Plastic Packaging |
Packaging made of plastic material, commonly used for most general applications, featuring lower cost and good mechanical properties. |
|
Connection Method |
|
|
PTH Packaging (Through-Hole) |
Connects by inserting pins into the through-holes on the circuit board and then soldering the pins to the board. Used in older electronic devices. |
|
SMT Packaging (Surface Mount) |
Connects by directly soldering the packaging component onto the surface of the circuit board, without the need for through-holes. Used in modern electronic devices, with a lower profile and higher integration. |
|
Package Outline |
|
|
SOT |
Small outline package, typically used for low-power and small-sized applications. |
|
SOIC |
Small outline package, suitable for general-purpose integrated circuit packaging, available in both straight-pin and bent-pin versions. |
|
TSSOP |
Thin-shrink small outline package, commonly used for high-density and high-performance applications. |
|
QFN |
Quad flat no-lead package, surface-mount packaging with no exposed pins, suitable for small, low-power, and high-performance ICs. |
|
QFP |
Quad flat package, surface-mount packaging with flat pins, typically used for medium to high-performance applications. |
|
BGA |
Ball grid array package, with small ball-shaped pins on the bottom, used for high-density and high-performance applications, offering excellent heat dissipation. |
|
CSP |
Chip-scale package, with dimensions similar to the chip itself, used for small mobile devices and high integration applications. |
IC packaging
Read More: https://en.wikipedia.org/wiki/List_of_integrated_circuit_packaging_types
What is SOIC
The Small Outline Integrated Circuit Package (SOIC) is a type of surface-mount integrated circuit (SMD) with a rectangular shape, featuring pins that protrude from both sides. It is among the most straightforward SMD packages to solder, with a pin pitch typically measuring 1.27 millimeters.
The SOIC package's pins have a gull-wing shape, providing stability during PCB assembly. Due to its advantages and characteristics, SOIC has become one of the most commonly used SMT IC packages today. Notably, it adheres to JEDEC standards and comes in various body widths, with 3.8 millimeters or 150 mils being the most popular.
The standard pin pitch for SOIC is 50 mils or 1.27 millimeters. This IC package is typically transported in the form of reels or tubes. There are several variations of SOIC packaging, including Small Outline J-Lead (SOJ), Mini Small Outline Package (MSOP), Shrink Small Outline Package (SSOP), and Thin Small Outline Package (TSOP). These variants feature different physical dimensions while maintaining a consistent pin pitch of 1.25 millimeters.
SOIC packaging is standardized and subject to regulations to simplify the assembly process. The nomenclature of this IC package typically includes the "SO" prefix, followed by a number indicating the specific IC's pin count.
Compared to Dual In-Line Package (DIP), Small Outline Integrated Circuit Packages are more compact. They are surface-mount IC packages that reduce the traditional DIP package to a smaller size. Furthermore, SOIC packages feature exposed solder pads, which aid in enhancing heat dissipation, thereby increasing operational safety margins.
|
Package |
Package Width (mm) |
Package Length (mm) |
Pin Pitch (mm) |
|
SOIC-4 |
3.90 mm |
4.90 mm |
1.27 mm |
|
SOIC-6 |
4.90 mm |
6.50 mm |
1.27 mm |
|
SOIC-8 |
5.30 mm |
9.90 mm |
1.27 mm |
|
SOIC-10 |
6.00 mm |
9.90 mm |
1.27 mm |
|
SOIC-12 |
6.50 mm |
9.90 mm |
1.27 mm |
|
SOIC-14 |
7.60 mm |
9.90 mm |
1.27 mm |
|
SOIC-16 |
8.20 mm |
10.30 mm |
1.27 mm |
|
SOIC-18 |
8.20 mm |
13.50 mm |
1.27 mm |
|
SOIC-20 |
9.90 mm |
14.30 mm |
1.27 mm |
|
SOIC-24 |
11.80 mm |
14.90 mm |
1.27 mm |
|
SOIC-28 |
11.80 mm |
15.40 mm |
1.27 mm |
|
SOIC-32 |
11.80 mm |
20.20 mm |
1.27 mm |
Common Narrow SOIC package sizes
Advantages of SOIC
SOIC packaging offers several distinct advantages. Compared to other IC packages, SOIC provides a range of benefits. The most prominent advantage of SOIC is its reduced footprint, which aids in the creation of smaller printed circuit boards. Furthermore, by reducing the materials used in the packaging, SOIC also minimizes the cost of manufacturing integrated circuits.
With its small-outline IC packaging, machine handling of small-sized components during PCB assembly is made easy. This type of IC packaging is especially conducive to the manufacturing of multi-layer boards since it falls under the category of surface-mount IC packaging. Another advantage of SOIC is its suitability for applications requiring cost-effective solutions.
Additionally, SOIC packaging uses a minimum of 0.50 inches in lead pitch, ensuring adequate spacing between pins or leads. This feature further enhances its reliability and widespread applicability in electronic devices.
Features of Small Outline Integrated Circuit (SOIC)
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Gull-Wing Lead Configuration
-
Multi-Layer Ceramic Packaging
-
Resemblance to Plastic SOP
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Gold-Plated Pins
-
Surface Mount
-
Multiple Versions
-
Consistent Pin Arrangement
SOIC Standard
SOIC packaging is a widely applicable type of packaging used in various application fields. It adheres to two different standards, JEITA and JEDEC.
The JEITA standard is formulated by the Japan Electronics and Information Technology Industries Association and is primarily used for evaluating performance parameters in the electronic and IT industries. On the other hand, JEDEC is an organization responsible for regulating semiconductor market activities and standardizing semiconductor part numbers as well as Electrostatic Discharge (ESD) standards.
The most apparent way to distinguish between JEITA and JEDEC standard SOIC packaging is through their size differences. JEITA standard SOIC packaging is smaller and lighter compared to JEDEC standard SOIC packaging.
JEDEC standards are widely used in the United States for manufacturing SOIC, while JEITA standards are primarily used in Japan.
Reference: https://en.wikipedia.org/wiki/Small_outline_integrated_circuit
SOIC Variants
|
Packaging Variant |
Full Name |
Description |
|
SOIC (Small Outline IC) |
Small Outline Integrated Circuit |
Standard SOIC package with a rectangular shape and moderate pin spacing. |
|
SOIC Wide (SOIC-W) |
Wide Small Outline IC |
Wider version of SOIC, suitable for applications needing more pins or wider pin spacing. |
|
TSSOP (Thin Shrink SOP) |
Thin Shrink Small Outline Package |
Slimmed-down SOIC variant with compact dimensions and tighter pin spacing. |
|
SOP (Small Outline Package) |
Small Outline Package |
Larger version of SOIC with wider pin spacing and a broader package. |
|
SSOP (Shrink SOP) |
Shrink Small Outline Package |
Smaller SOIC variant with a more compact design, ideal for high-density packaging. |
|
MSOP (Mini SOP) |
Mini Small Outline Package |
Extremely compact SOIC variant for applications requiring a very small footprint. |
|
ESOP (Enhanced SOP) |
Enhanced Small Outline Package |
Suitable for high-frequency applications with improved high-frequency performance. |
|
HSOP (Heat Sink SOP) |
Heat Sink Small Outline Package |
Equipped with a heat sink for better heat dissipation, making it ideal for high-power use. |
What is SSOP
SSOP, or Shrink Small Outline Package, represents a streamlined version of the SOIC (Small Outline Integrated Circuit) packaging. SSOP is widely recognized as a compact alternative to SOIC and integrates surface-mount technology (SMT) within the confines of the integrated circuit package. This specific variant of SOIC finds its niche in applications demanding optimal performance and a reduced lead pitch.
SSOP packages, in comparison to their larger SOIC counterparts, are notably smaller in size. Furthermore, SSOP accommodates this reduced form factor with a tighter lead pitch. SSOP packages are available in various lead counts, typically ranging from 8 to 64, with body dimensions spanning approximately 209 to 300 mil. Notably, SSOP packaging aligns with industry standards such as EIAJ and JEDEC.
The IC packaging demonstrates a significant reduction in size, delivering a cost-effective and value-added solution for diverse applications. SSOP packages feature gull-wing leads extending from one of its longer sides. This versatile IC packaging is commonly employed in end products like disk drives, RDF devices, components, wireless devices, and telecommunications equipment. The compact SSOP option offers multiple advantages, including enhanced electrical performance and improved heat dissipation.
Moreover, SSOP packaging boasts tin-plated leads, enhancing its performance in specific applications. Leads are positioned on both sides of the periphery, with the lead pitch typically falling below 1.0mm.
Features of SSOP
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Varying Lead Counts
-
Component packaging available in tape and reel formats as per requirements
-
Body width ranging from 209 to 300 mil
-
Copper lead frames with high conductivity
-
Humidity sensitivity compliant with JEDEC Level 3 standards
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Multi-mold production capability
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Higher lead frame density
-
Conforms to standard JEDEC packaging outlines
SOIC vs. SSOP
SOIC (Small Outline Integrated Circuit) packaging is a surface-mount integrated circuit featuring a rectangular body with leads extending from both sides. SOIC is known for its ease of soldering, making it one of the most user-friendly SMD components. The pin spacing on SOIC packaging typically measures around 1.27mm.
SSOP (Shrink Small Outline Package) is a variant of SOIC packaging often referred to as a compact version of SOIC. SSOP incorporates surface-mount technology (SMT) into the integrated circuit package and is well-suited for applications where optimal performance with tighter lead spacing is crucial.
The primary distinctions between these IC packages revolve around their size and lead spacing. SOIC maintains a 1.27mm lead spacing, which corresponds to the spacing between each pin. Conversely, SSOP packaging features a lead spacing of less than 1.0mm. In contrast, the standard lead pitch for SOIC packaging is 50 mils, or 1.27mm.
Upon comparing SOIC and SSOP packaging, you'll notice certain resemblances between these package types. This is because SSOP packaging is essentially a scaled-down version of SOIC. As a result, these packages share several similarities. This comparison delves into the characteristics, benefits, and applications of both SOIC and SSOP packaging.
SOIC vs. TSSOP
TSSOP (Thin Shrink Small Outline Package) stands for a slimmed-down version of the Small Outline Integrated Circuit (SOIC) packaging, incorporating surface-mount technology for integrated circuits. TSSOP offers an efficient solution for mounting integrated circuits on PCBs. It resembles a flat rectangular IC chip affixed to a plastic encapsulation with fine, elongated pins or leads arranged along its perimeter.
As the name suggests, TSSOP is a compact variant of SOIC. The slender profile of this IC package allows for higher circuit board density. Moreover, TSSOP is more compact and thinner compared to other IC packaging or SOIC variants. Its space-saving characteristics make it an ideal choice for applications requiring robust functionality and high-level integration within limited space.
While TSSOP is a variant of SOIC packaging, it is even more compact than SSOP. The Shrink Small Outline Package, often referred to as SSOP, is a smaller version of SOIC packaging that integrates surface-mount technology into IC packaging. This SOIC variant is particularly well-suited for applications demanding optimal performance in tight lead spacing.
In addition to its compactness, TSSOP offers enhanced heat dissipation compared to SSOP. The close proximity between the leads and the IC chip results in outstanding electrical performance, reducing parasitic inductance and shortening signal paths.
Significantly reducing the package size, TSSOP provides a cost-effective and value-added solution for a variety of applications. TSSOP's gull-wing pins extend from one of its longer sides. It boasts a wide array of advantages, including improved reliability, especially in electronic devices.
TSSOP 8 vs SOIC 8
SOIC 8
TSSOP 8
Final Words
SOIC packaging is available in several variants, which include TSSOP, SOIC, MSOP, and SOJ. In this article, we have focused on SOIC and TSSOP. These IC packages rank among the industry's most favored options. SOIC packaging and its variants employ surface-mount technology for IC packaging, providing them with distinct advantages.
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Extended Reading
FAQ
-
Is SOP 8 the same as SOIC 8?
SOP-8 and SOIC-8 are similar in that they both refer to 8-pin integrated circuit packages, but they have different package outlines and dimensions. SOIC-8 stands for Small Outline Integrated Circuit 8, and it typically has a 150-mil body width (approximately 3.8 mm) and a 50-mil (1.27 mm) lead pitch. SOIC-8 is a common surface-mount IC package. SOP-8, on the other hand, stands for Small Outline Package 8. It has a larger body width of 209 mils (approximately 5.3 mm) and a 50-mil (1.27 mm) lead pitch. SOP-8 is also a surface-mount package but with different dimensions than SOIC-8. While both packages have 8 pins and a 1.27 mm lead pitch, the key difference is the body width.
-
What is the difference between TSSOP and SOIC footprint?
As the name suggests, TSSOP is thinner than SOIC. The reduced thickness of TSSOP allows for greater component density on a circuit board, making it more suitable for space-constrained designs. TSSOP is typically more compact than SOIC, contributing to its higher component density.
-
What size are SOIC chips?
SOIC chips come in various sizes, with the most common being either the narrow body, which is 150 mils wide or approximately 3.8 mm, or the wide body, which is 300 mils wide or about 7.5 mm. The standard lead pitch for SOIC packages is nominally 50 mils (1.27 mm). This flexibility in size and pitch makes SOIC ideal for applications that demand high-density placement of chips on PCBs.
-
What is SOIC in PCB?
In the context of a PCB (Printed Circuit Board), SOIC refers to a surface-mount integrated circuit package. This standard package typically takes the form of a flat rectangular body with leads extending from two sides. These leads are designed in a gull-wing shape, which facilitates secure attachment during the assembly process to the PCB.
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What is the difference between SOIC and SOT?
SOIC, or Small Outline Integrated Circuit, can be seen as the surface-mount counterpart of the traditional through-hole DIP (Dual-Inline Package). On the other hand, SOT is a direct surface-mount-device (SMD) equivalent of the conventional through-hole SOT package.
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What is the difference between PDIP and SOIC?
SOIC, which stands for Small Outline Integrated Circuit, is commonly employed in modern electronic circuits, often serving as direct substitutes for PDIP circuits. SOIC typically employs surface-mount-device (SMD) packaging, whereas PDIP utilizes pin-in-hole (PIH) packaging. This transition to SOIC offers compatibility with contemporary electronic systems and facilitates smaller, more space-efficient designs.
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What is SOIC used for?
SOIC stands as a pivotal technological cornerstone in propelling the domain of heterogeneous chiplet integration towards smaller form factors and enhanced performance capabilities. It incorporates ultra-high-density vertical stacking to deliver superior performance, energy efficiency, and minimal impedance.
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