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NXP LPC1114FHN33/302,5

ARM Microcontrollers - MCU 32BIT ARM CORTEX-M0 MCU 32KB FL 8KB SRAM

ISO14001 ISO9001 DUNS

Brands: NXP Semiconductor

Mfr.Part #: LPC1114FHN33/302,5

Datasheet: LPC1114FHN33/302,5 Datasheet (PDF)

Package/Case: HVQFN-33

Product Type: Embedded Processors & Controllers

RoHS Status:

Stock Condition: 3257 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for LPC1114FHN33/302,5 or email to us: Email: [email protected], we will contact you within 12 hours.

LPC1114FHN33/302,5 General Description

MCU, 32BIT, CORTEX M0, 32VQFN; Controller Family/Series:ARM Cortex-M0; Core Size:32bit; No. of I/O's:28; Supply Voltage Range:1.8V to 3.6V; Digital IC Case Style:HVQFN; No. of Pins:33; Program Memory Size:32KB; RAM Memory Size:8KB; CPU Speed:50MHz; Oscillator Type:External, Internal; No. of Timers:4; Peripherals:ADC, Timer; Embedded Interface Type:I2C, SPI, UART; Operating Temperature Range:-40°C to +85°C; MSL:MSL 1 - Unlimited

LPC1114FHN33/302,5

Features

32kB flash, 8kB SRAM, HVQFN32 package

Specifications

Parameter Value Parameter Value
Source Content uid LPC1114FHN33/302,5 Rohs Code Yes
Part Life Cycle Code Active Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFN Package Description HVQCCN, LCC32,.27SQ,25
Pin Count 32 Manufacturer Package Code SOT865-3
Reach Compliance Code compliant ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 Samacsys Manufacturer NXP
Has ADC YES Address Bus Width
Bit Size 32 CPU Family CORTEX-M0
DAC Channels NO DMA Channels NO
External Data Bus Width JESD-30 Code S-PQCC-N32
Moisture Sensitivity Level 3 Number of I/O Lines 28
Number of Terminals 33 PWM Channels NO
Package Body Material PLASTIC/EPOXY Package Code HVQCCN
Package Equivalence Code LCC32,.27SQ,25 Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Peak Reflow Temperature (Cel) 260
Surface Mount YES Technology CMOS
Temperature Grade INDUSTRIAL Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form NO LEAD Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The LPC1114FHN33/302,5 is a microcontroller chip from NXP Semiconductors, featuring an ARM Cortex-M0 processor, 32KB flash memory, 4KB SRAM, and various peripherals. It is commonly used in embedded systems for applications requiring low power consumption and cost effectiveness.
  • Equivalent

    Some equivalent products of LPC1114FHN33/302,5 chip include LPC1114FBD48/302,5, LPC1114FBD48/301, and LPC1114FBD48/302 chips. These chips have similar features and capabilities as the LPC1114FHN33/302,5 chip.
  • Features

    Some features of LPC1114FHN33/302,5 are: - ARM Cortex-M0 processor - Up to 50 MHz clock frequency - 32 kB flash memory - 8 kB SRAM - 48 MHz SPI, I2C, UART - 4-channel 10-bit ADC - Two 32-bit timers - 2x Voltage comparators - 33 GPIO pins - Low power consumption and small form factor.
  • Pinout

    The LPC1114FHN33/302,5 is a 33-pin microcontroller with Flash (code) memory, 16KB RAM, and a 50MHz ARM Cortex-M0 processor. Its pins include multiple GPIO, UART, SPI, and I2C interfaces, plus analog and power management functions. It is commonly used in embedded systems and IoT applications.
  • Manufacturer

    The manufacturer of the LPC1114FHN33/302,5 is NXP Semiconductors, a multinational semiconductor manufacturer based in the Netherlands. NXP specializes in the production of a wide range of semiconductor products, including microcontrollers, security chips, and sensors, for various industries such as automotive, industrial, and consumer electronics.
  • Application Field

    The LPC1114FHN33/302,5 microcontroller is commonly used in various application areas including consumer electronics, automotive applications, industrial control systems, medical devices, and communication devices. Its low power consumption, high performance, and versatility make it suitable for a wide range of embedded applications.
  • Package

    The LPC1114FHN33/302,5 chip comes in a surface-mount package type, specifically an LQFP (Low-profile Quad Flat Package). It has 64 pins and measures 10mm x 10mm in size.

Datasheet PDF

Preliminary Specification LPC1114FHN33/302,5 PDF Download

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