Xilinx XC7Z045-1FFG900I

Part points

• The XC7Z045-1FFG900I chip is a high-performance integrated circuit designed for use in programmable digital systems. It belongs to the Xilinx Zynq-7000 family and features a dual-core ARM Cortex-A9 processor along with programmable logic circuitry. The chip offers advanced computing capabilities and is commonly used in applications like embedded systems, industrial automation, and high-performance computing.

• Equivalent

  Some equivalent products of the XC7Z045-1FFG900I chip are the Zynq-7000 XC7Z045-1FFG900, XC7Z045-1FFG676, and XC7Z045-2FFG900I chips. These alternatives provide similar features and can be used as replacements for the XC7Z045-1FFG900I chip in various applications.

• Features

  XC7Z045-1FFG900I is a high-performance system-on-chip (SoC) device from Xilinx. It features a dual-core ARM Cortex-A9 processor, programmable logic with 1.3 million logic cells, and up to 5930 DSP slices. The device also includes high-speed serial interfaces, memory controllers, and an extensive set of peripherals for versatile system integration.

• Pinout

  The XC7Z045-1FFG900I is a Xilinx Zynq-7000 series system-on-chip (SoC) with a pin count of 900. It offers a combination of an ARM processor and FPGA fabric, making it suitable for a wide range of applications that require high-performance processing and programmable logic capabilities.

• Manufacturer

  The manufacturer of the XC7Z045-1FFG900I is Xilinx Inc. Xilinx is a technology company specializing in the development and production of programmable logic devices and associated software tools. They are known for their field-programmable gate arrays (FPGAs) and system on a chip (SoC) solutions, which are widely used in areas such as aerospace and defense, automotive, communications, and industrial applications.

• Application Field

  The XC7Z045-1FFG900I is an FPGA-based system on a chip (SoC) suitable for a wide range of applications. It can be used in industrial automation, medical devices, automotive electronics, aerospace, and defense systems, among others. With its high-performance processing capabilities, extensive I/O interfaces, and programmability, it offers flexibility and scalability in various embedded system designs.

• Package

  The XC7Z045-1FFG900I chip is available in a 900-ball flip-chip BGA (Ball Grid Array) package. The chip has a form factor of 19x19 mm and features a total of 900 solder balls for interconnection.