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Altera EP3C25F324I7N

FPGA Cyclone® III Family 24624 Cells 437.5MHz 65nm Technology 1.2V 324-Pin FBGA

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: EP3C25F324I7N

Datasheet: EP3C25F324I7N Datasheet (PDF)

Package/Case: FBGA-324

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3500 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for EP3C25F324I7N or email to us: Email: [email protected], we will contact you within 12 hours.

EP3C25F324I7N General Description

EP3C25F324I7N is a part number for a Field-Programmable Gate Array (FPGA) manufactured by Altera Corporation (now Intel Corporation).

ep3c25f324i7n

Features

  • 25,440 logic elements (LEs)
  • 504 embedded memory blocks (MBs)
  • 72 embedded 18 x 18 multipliers
  • 4 phase-locked loops (PLLs)
  • 316 user I/O pins
  • Supports various I/O standards such as LVDS, SSTL, and HSTL

Application

  • Communications
  • Video and image processing
  • Industrial automation and control
  • Medical equipment
  • Automotive systems
  • Aerospace and defense
Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
Product Name EP3C25F324I7N Product Type Field-Programmable Gate Array (FPGA)
Manufacturer Intel (Altera) Logic Elements 25,000
Available I/Os 179 Embedded Memory 356 Kbits
Operating Voltage Range 1.15V to 1.25V (core), 3.0V to 3.6V (I/O) Operating Temperature 0°C to +85°C
Package / Case 324-Pin BGA (Ball Grid Array) Packaging Tape & Reel, Tray, and other options
feature-family-name Cyclone® III feature-process-technology 65nm
feature-maximum-number-of-user-i-os 215 feature-number-of-registers
feature-device-logic-cells 24624 feature-device-system-gates
feature-number-of-multipliers 66 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 594 feature-total-number-of-block-ram 66
feature-ethernet-macs feature-supported-ip-core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V1 ColdFire|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|10 Gigabit Ethernet MAC|32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz
feature-supported-ip-core-manufacture Altera/Freescale/CAST, Inc/MorethanIP/PLDA feature-maximum-number-of-serdes-channels
feature-device-logic-units 24624 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks feature-transceiver-speed-gbps
feature-dedicated-dsp feature-pci-blocks
feature-programmability No feature-maximum-internal-frequency-mhz 437.5
feature-speed-grade 7 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS feature-single-ended-i-o-standards-supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
feature-external-memory-interface DDR2 SDRAM|QDRII+SRAM feature-minimum-operating-supply-voltage-v 1.15
feature-maximum-operating-supply-voltage-v 1.25 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 324 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc Yes

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the EP3C25F324I7N component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   EP3C25E144C8N

Brands :  

Package :   TQFP144

Description :   ALTERA EP3C25E144C8N FPGA, Cyclone III, PLL, 82 I/O"s, 402MHz, 1.15V to 1.25V, QFP-144

Part Number :   EP3C25U256C8N

Brands :  

Package :   BGA-256

Description :   FPGA, CYCLONE III, 25K LE, 256UBGA Programmable Logic Type:FPGA; Logic IC function:FPGA; Logic IC family:Cyclone III; Logic IC Base Number:3; I/O lines, No. of:156;

Part Number :   EP3C25Q240C8N

Brands :  

Package :   PQFP-240

Description :   FPGA, CYCLONE III, 25K LE, 240PQFP

Part Number :   EP3C25F256I7N

Brands :  

Package :   FBGA-256

Description :   FPGA Cyclone® III Family 24624 Cells 437.5MHz 65nm Technology 1.2V

Part Number :   EP3C25F324C8N

Brands :  

Package :   FBGA-324

Description :   BGA bulk new, guarantee 90days FPGA

Part points

  • The EP3C25F324I7N chip is a field-programmable gate array (FPGA) designed by Intel. It features 24,624 logic elements, 534 Kbits of RAM, and 193 I/O pins. This chip is commonly used in various applications such as telecommunications, data processing, and industrial automation due to its flexibility and customizable nature.
  • Equivalent

    Some equivalent products of EP3C25F324I7N chip are Altera Cyclone III EP3C25F324C6, Cyclone III EP3C25F324C8, and Cyclone III EP3C25F324I7. These chips come with similar features and capabilities, making them suitable replacements for the EP3C25F324I7N chip in certain applications.
  • Features

    1. 2,304 Logic Elements 2. 25,920 bits RAM 3. 288 Kbits User Flash memory 4. 4 PLLs, 8 DLLs 5. 4 SERDES channels 6. 266 user I/Os 7. Dual Configuration (Factory/Pin) 8. Low Power consumption 9. JTAG Debug Module 10. RoHS compliant
  • Pinout

    The EP3C25F324I7N is a FPGA with 324 pins. It is designed for complex applications requiring high performance, such as video or signal processing. The functions of the pins include I/O, power supply, configuration, and clock inputs.
  • Manufacturer

    The EP3C25F324I7N is manufactured by Intel Corporation. Intel Corporation is an American multinational corporation that designs and manufactures semiconductor chips and other technologies for a variety of computing and networking applications. They are one of the largest and most well-known technology companies in the world.
  • Application Field

    The EP3C25F324I7N is commonly used in applications such as communication systems, automotive electronics, industrial control systems, and medical devices. It is also utilized in consumer electronics, aerospace technology, and computer peripherals. Additionally, it is suitable for applications that require high-performance, low power consumption, and small form factor design.
  • Package

    The EP3C25F324I7N chip comes in a Ball Grid Array (BGA) package form. It has a size of 324 balls and a body size of 17 x 17 mm.

Datasheet PDF

Preliminary Specification EP3C25F324I7N PDF Download

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