Xilinx XC7Z030-1SBG485I
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 667MHz 11.8V
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7Z030-1SBG485I
Datasheet: XC7Z030-1SBG485I Datasheet (PDF)
Package/Case: FCBGA-485
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2948 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7Z030-1SBG485I General Description
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-485; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:485Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-1SBG485I
Features
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells256KB 667MHz 485-FBGA (19x19)Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells256KB 667MHz 485-FBGA (19x19)Specifications
Parameter | Value | Parameter | Value |
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Pin Count | 484 | Package Category | BGA |
Released Date | Aug 21, 2017 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
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Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7Z030-1SBG485I chip is a member of the Xilinx Zynq-7000 family of devices. It is a programmable system-on-chip (SoC) that integrates a dual-core ARM Cortex-A9 processor with Xilinx programmable logic. The chip offers a wide range of features and capabilities, making it suitable for various applications, including automotive, industrial automation, and aerospace, among others.
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Features
Features of XC7Z030-1SBG485I include a dual-core ARM Cortex-A9 processor, programmable logic cells with 192K logic cells, 4.9Mbit BRAM, and 169 DSP slices. It also offers various connectivity options such as PCIe, Ethernet, USB, and CAN, along with support for DDR3 memory. Additionally, it is compatible with the Zynq-7000 All Programmable SoC platform. -
Pinout
The XC7Z030-1SBG485I has a pin count of 485. The device is a SoC (System on a Chip) with a dual-core ARM Cortex-A9 processor and an FPGA (Field Programmable Gate Array). It offers a wide range of I/O interfaces and can be used for various applications such as embedded systems and high-performance computing. -
Manufacturer
Xilinx is the manufacturer of the XC7Z030-1SBG485I. Xilinx is a leading American semiconductor company that specializes in field-programmable gate array (FPGA) technologies. Their products are used in various industries such as automotive, aerospace, telecommunications, and data centers for advanced computing and processing applications. -
Application Field
The XC7Z030-1SBG485I is a System-on-Chip (SoC) device that integrates a dual-core ARM Cortex-A9 processor with programmable logic. It is primarily used in applications that require high-performance processing combined with customizable hardware acceleration, such as industrial automation, automotive systems, aerospace, telecommunications, and high-performance computing. -
Package
The XC7Z030-1SBG485I chip is available in a 485-pin Fine-pitch Ball Grid Array (FBGA) package.
Datasheet PDF
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