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Xilinx XC7K70T-2FBG676C
FPGA - Field Programmable Gate Array XC7K70T-2FBG676C
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7K70T-2FBG676C
Datasheet: XC7K70T-2FBG676C Datasheet (PDF)
Package/Case: BGA676
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3516 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7K70T-2FBG676C General Description
Fpga, Kintex-7 , 200 I/O, Fcbga-676; No. Of Logic Blocks:10250; No. Of Macrocells:65600; Fpga Family:Kintex-7; Logic Case Style:Fcbga; No. Of Pins:676Pins; No. Of Speed Grades:2; Total Ram Bits:4860Kbit; No. Of I/O S:200I/O S; Clock Rohs Compliant: Yes |Amd Xilinx XC7K70T-2FBG676C
Features
IC FPGA 300 I/O 676FCBGAIC FPGA 300 I/O 676FCBGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 676 | Package Category | BGA |
| Released Date | Mar 15, 2022 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7K70T-2FBG676C chip is a member of the Xilinx 7-series field-programmable gate array (FPGA) family. It offers a significant amount of programmable logic resources, high-performance transceivers, and memory blocks to enable the implementation of complex digital circuits. The chip supports various digital communication protocols and is commonly used in applications such as telecommunications, networking, and data processing.
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Equivalent
The equivalent products of the XC7K70T-2FBG676C chip are the XC7K70T-2FBG676I and XC7K70T-2FBG676E chips. -
Features
The XC7K70T-2FBG676C is an FPGA device from Xilinx. It has a capacity of 68,600 logic cells, 3,420 Kbits of block RAM, and 92 DSP slices. It also features high-speed I/O interfaces, PCIe support, and programmable clock management. Overall, it offers a powerful and flexible solution for various applications in the electronics industry. -
Pinout
The XC7K70T-2FBG676C is a 676-pin FPGA from Xilinx. It has various functions including a configurable logic block, DSP slices, block RAM, clock management resources, and high-speed serial transceivers. Specific pin count and function details can be found in the device datasheet provided by Xilinx. -
Manufacturer
Xilinx Inc. is the manufacturer of the XC7K70T-2FBG676C. It is a technology company specializing in the development and production of programmable logic devices, software, intellectual property, and related services. Xilinx's products find applications in various industries, including aerospace, automotive, industrial, and telecommunications. -
Application Field
The XC7K70T-2FBG676C is a field-programmable gate array (FPGA) chip that can be used in a variety of application areas, including telecommunications, data centers, aerospace and defense, and industrial automation. It provides powerful processing capabilities and flexibility for implementing complex algorithms and designs in these industries. -
Package
The XC7K70T-2FBG676C chip is available in a FBG676 package type. The package form is a grid array, and the size of the package is 27mm x 27mm.
Datasheet PDF
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