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MCP23S17T-E/ML
I/O Expander 16 SPI 10 MHz 28-QFN (6x6)
Brands: MICROCHIP TECHNOLOGY INC
Mfr.Part #: MCP23S17T-E/ML
Datasheet: MCP23S17T-E/ML Datasheet (PDF)
Package/Case: HVQCCN
RoHS Status:
Stock Condition: 5664 pcs, New Original
Product Type: Interface - I/O Expanders
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $1.869 | $1.869 |
| 10 | $1.611 | $16.110 |
| 30 | $1.449 | $43.470 |
| 100 | $1.284 | $128.400 |
| 500 | $1.209 | $604.500 |
| 1000 | $1.178 | $1178.000 |
In Stock:5664 PCS
MCP23S17T-E/ML General Description
The MCP23017/MCP23S17 (MCP23X17) device family provides 16-bit, general purpose parallel I/O expansion for I2C bus or SPI applications. The two devices differ only in the serial interface.
• MCP23017 – I2C interface
• MCP23S17 – SPI interface
The MCP23X17 consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits (IODIRA/B). The data for each input or output is kept in the corresponding input or output register. The polarity of the Input Port register can be inverted with the Polarity Inversion register. All registers can be read by the system master.
Features
- 16-bit input/output port expander with interrupt output
- Cascadable for up to 8 devices on one bus
- 25mA sink/source capability per I/O
- Supports up to 10MHz SPI™ clock speeds
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Source Content uid | MCP23S17T-E/ML | Pbfree Code | Yes |
| Rohs Code | Yes | Part Life Cycle Code | Active |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | Part Package Code | QFN |
| Package Description | QFN-28 | Pin Count | 28 |
| Reach Compliance Code | compliant | ECCN Code | EAR99 |
| HTS Code | 8542.39.00.01 | Factory Lead Time | 52 Weeks |
| Samacsys Manufacturer | Microchip | CPU Family | MCP23X17 |
| Clock Frequency-Max | 10 MHz | JESD-30 Code | S-PQCC-N28 |
| JESD-609 Code | e3 | Length | 6 mm |
| Moisture Sensitivity Level | 1 | Number of Bits | 16 |
| Number of I/O Lines | 16 | Number of Ports | 16 |
| Number of Terminals | 28 | Operating Temperature-Max | 125 °C |
| Operating Temperature-Min | -40 °C | Package Body Material | PLASTIC/EPOXY |
| Package Code | HVQCCN | Package Equivalence Code | LCC28,.24SQ,25 |
| Package Shape | SQUARE | Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 | Qualification Status | Not Qualified |
| Seated Height-Max | 1 mm | Supply Current-Max | 1 mA |
| Supply Voltage-Max | 5.5 V | Supply Voltage-Min | 4.5 V |
| Supply Voltage-Nom | 5 V | Surface Mount | YES |
| Technology | CMOS | Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Matte Tin (Sn) | Terminal Form | NO LEAD |
| Terminal Pitch | 0.65 mm | Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 40 | Width | 6 mm |
| uPs/uCs/Peripheral ICs Type | PARALLEL IO PORT, GENERAL PURPOSE |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The MCP23S17T-E/ML is a 16-bit I/O expander with SPI interface, allowing users to add additional input and output pins to their microcontroller without using up additional I/O pins. This chip is commonly used in applications where a large number of I/O pins are required, such as in industrial automation, robotics, and LED display control.
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Equivalent
Equivalent products of MCP23S17T-E/ML chip include MCP23S17-E/SO, MCP23S17-E/SS, and MCP23S17T-E/SS. These chips are also 16-bit I/O expanders with SPI interface and similar specifications as MCP23S17T-E/ML. -
Features
- 16-bit SPI interface - 25mA sink/source per I/O - Operating voltage range of 1.8V to 5.5V - High-speed clock up to 10 MHz - Configurable interrupt output pins - Cascadable for up to 8 devices - ESD protection exceeds 8000V -
Pinout
The MCP23S17T-E/ML is a 28-pin device that is a 16-bit I/O expander with SPI interface. It has 16 I/O pins that can be configured as inputs or outputs, allowing for easy interfacing with microcontrollers. -
Manufacturer
Microchip Technology is the manufacturer of MCP23S17T-E/ML. It is a leading provider of microcontroller, analog and RF devices, and mixed-signal, and security products. They offer solutions for a wide range of industries, including automotive, industrial, aerospace, and consumer electronics. -
Application Field
The MCP23S17T-E/ML is commonly used in applications requiring interfacing with external devices such as sensors, switches, LEDs, and motors. It is widely used in automation, robotics, industrial control systems, home automation, and IoT devices for expanding the input/output capabilities of microcontrollers and communication with SPI bus. -
Package
The MCP23S17T-E/ML chip is available in a QFN-28 package with a 5mm x 5mm x 0.9mm size.
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