Xilinx XC7K410T-2FF900I

Part points

• The XC7K410T-2FF900I is a chip from the Xilinx Kintex-7 FPGA (Field-Programmable Gate Array) family. It offers high-performance processing, efficient power consumption, and reconfigurability. With 410,000 logic cells, various I/O options, and 2-speed grade capabilities, it is suitable for a wide range of applications, including aerospace, telecommunications, and industrial automation.

• Equivalent

  There are no direct equivalents to the XC7K410T-2FF900I chip. However, similar products within the Xilinx 7-series FPGA family may include the XC7K325T-2FFG900I or the XC7K480T-2FFG900I. These chips have similarities in terms of features and capabilities but may have different specifications and performance levels.

• Features

  The XC7K410T-2FF900I is a field-programmable gate array (FPGA) with 410,000 logic cells and a speed grade of -2. It operates at a voltage of 0.95V and has a maximum operating frequency of 900 MHz. The device belongs to the Kintex-7 series and offers high-performance processing and connectivity capabilities for various applications.

• Pinout

  The XC7K410T-2FF900I is a field-programmable gate array (FPGA) with a pin count of 900. This FPGA is part of the Xilinx Kintex-7 family and has a wide range of functions, including digital signal processing, connectivity interfaces, and high-speed serial communication capabilities.

• Manufacturer

  Xilinx is the manufacturer of the XC7K410T-2FF900I. It is a semiconductor company that specializes in programmable logic devices, such as field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). Xilinx provides hardware and software tools for designing and programming their devices, catering to various industries, including automotive, communications, and industrial applications.

• Application Field

  The XC7K410T-2FF900I is a field-programmable gate array (FPGA) that can be used in a variety of application areas. Some common uses include telecommunications, high-performance computing, industrial automation, aerospace and defense, and medical imaging.

• Package

  The XC7K410T-2FF900I chip has a package type of flip-chip ball grid array (FCBGA). It is available in a form factor of 900 pin grid array (PGA) and has a size of 31mm x 31mm.