Images are for reference only See Product Specifications
TI CC2340R52E0RKPR
IC RF TxRx + MCU Bluetooth Bluetooth v5.3, Wireless M-Bus, Zigbee® 2.36GHz ~ 2.5GHz 40-VFQFN Exposed Pad
Brands: Texas Instruments
Mfr.Part #: CC2340R52E0RKPR
Datasheet: CC2340R52E0RKPR Datasheet (PDF)
Package/Case:
Product Type: RF System on a Chip - SoC
CC2340R52E0RKPR General Description
The SimpleLink™ CC2340R5 device is a 2.4 GHz wireless microcontroller (MCU) targeting Bluetooth® 5.3 Low Energy and Proprietary 2.4 GHz applications. The device is optimized for low-power wireless communication with on-chip dual image Over the Air Download (OAD) support (1) in Building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf label), and Personal electronics (toys, HID, stylus pens) markets. highlighted features of this device include:
- Support for Bluetooth ® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and support for key features from the Bluetooth ® 4.2 and earlier Low Energy specifications.
- Fully-qualified Bluetooth ® 5.3 software protocol stack included with the SimpleLink™ CC23xx Software Development Kit (SDK).
- Zigbee® protocol stack support in the SimpleLink™ CC23xx Software Development Kit (SDK) 2
- Ultra-low standby current less than 0.71 µA with RTC operational and full RAM retention that enables significant battery life extension especially for applications with longer sleep intervals.
- Integrated balun for reduced Bill-of-Material (BOM) board layout
- Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy (-102 dBm for 125 kbps LE Coded PHY, with integrated balun).
The CC2340R5 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
(1)Available in a future SDK
Features
Wireless microcontroller
- Optimized 48-MHz Arm Cortex-M0+ processor
- 512 KB of in-system programmable flash
- 12 KB of ROM for bootloader and drivers
- 36 KB of ultra-low leakage SRAM. Full RAM retention in standby mode
- 2.4 GHz RF transceiver compatible with Bluetooth 5.3 Low Energy
- Integrated balun
- Supports over-the-air upgrade (OTA)
- Serial Wire Debug (SWD)
Low power consumption
- MCU consumption:
- 2.6 mA active mode, CoreMark
- 53 µA/MHz running CoreMark
- < 710 nA standby mode, RTC, 36 KB RAM
- 150 nA shutdown mode, wake-up on pin
- Radio Consumption:
- 5.3 mA RX
- 5.1 mA TX at 0 dBm
- < 11.0 mA TX at +8 dBm
Wireless protocol support
- Bluetooth® 5.3 Low Energy
- Zigbee® (1)
- SimpleLink™ TI 15.4-stack 1
- Proprietary systems
High-performance radio
- -102 dBm for Bluetooth® Low Energy 125 kbps
- -96.5 dBm for Bluetooth® Low Energy 1 Mbps
- Output power up to +8 dBm with temperature compensation
Regulatory compliance
- Suitable for systems targeting compliance with these standards:
- EN 300 328 (Europe)
- FCC CFR47 Part 15
- ARIB STD-T66 (Japan)
MCU peripherals
- Up to 26 I/O Pads
- 2 IO pads SWD, muxed with GPIOs
- 2 IO pads LFXT, muxed with GPIOs
- Up to 22 DIOs (analog or digital IOs)
- 3× 16-bit and 1× 24-bit general-purpose timers, quadrature decode mode support
- 12-bit ADC, 1.2 Msps with external reference, 267 ksps with internal reference, up to 12 external ADC inputs
- 1× low power comparator
- 1× UART
- 1× SPI
- 1× I 2C
- Real-time clock (RTC)
- Integrated temperature and battery monitor
- Watchdog timer
Security enablers
- AES 128-bit cryptographic accelerator
- Random number generator from on-chip analog noise
Development tools and software
- LP-EM-CC2340R5 LaunchPad Development Kit
- SimpleLink™ CC23xx Software Development Kit (SDK)
- SmartRF™ Studio for simple radio configuration
- SysConfig system configuration tool
Operating range
- On-chip buck DC/DC converter
- 1.71-V to 3.8-V single supply voltage
- T j: -40 to +125°C
RoHS-compliant package
- 5-mm × 5-mm RKP QFN40 (26 GPIOs)
- 4-mm × 4-mm RGE QFN24 (12 GPIOs)
(1)Available in a future SDK
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer | Texas Instruments | Product Category | RF System on a Chip - SoC |
| RoHS | Details | Type | BLE 5.3 |
| Core | ARM Cortex M0+ | Operating Frequency | 2.4 GHz |
| Output Power | 8 dBm | Supply Voltage - Min | 1.71 V |
| Supply Voltage - Max | 3.8 V | Program Memory Size | 512 kB |
| Minimum Operating Temperature | - 40 C | Maximum Operating Temperature | + 125 C |
| Package / Case | VQFN-40 | ADC Resolution | 12 bit |
| Brand | Texas Instruments | Data RAM Size | 36 kB |
| Data RAM Type | SRAM | Height | 1 mm |
| Interface Type | I2C, SPI, UART | Length | 5 mm |
| Maximum Clock Frequency | 48 MHz | Moisture Sensitive | Yes |
| Mounting Style | SMD/SMT | Number of I/Os | 26 I/O |
| Number of Timers | 3 x 16 bit, 1 x 24 bit | Operating Supply Voltage | 1.71 V to 3.8 V |
| Operating Temperature Range | - 40 C to + 125 C | Product Type | RF System on a Chip - SoC |
| Program Memory Type | Flash | Series | CC2340R5 |
| Factory Pack Quantity | 3000 | Subcategory | Wireless & RF Integrated Circuits |
| Technology | Si | Tradename | SimpleLink |
| Width | 5 mm |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
-
Step1 :Product
-
Step2 :Vacuum packaging
-
Step3 :Anti-static bag
-
Step4 :Individual packaging
-
Step5 :Packaging boxes
-
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We provide high quality products, thoughtful service and after sale guarantee
-
We have rich products, can meet your various needs.
-
Minimum order quantity starts from 1pcs.
-
Lowest international shipping fee starts from $0.00
-
365 days quality guarantee for all products
