Xilinx XC7K325T-3FFG900E
Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 16404480 326080 900-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7K325T-3FFG900E
Datasheet: XC7K325T-3FFG900E Datasheet (PDF)
Package/Case: BGA900
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2188 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7K325T-3FFG900E General Description
Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 16404480 326080 900-BBGA, FCBGA
Features
IC FPGA 500 I/O 900FCBGAIC FPGA 500 I/O 900FCBGASpecifications
Parameter | Value | Parameter | Value |
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Pin Count | 900 | Package Category | BGA |
Released Date | Dec 26, 2018 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7K325T-3FFG900E chip is a high-performance field-programmable gate array (FPGA) from Xilinx. It belongs to the Kintex-7 family and is designed for various applications, including telecommunications, industrial automation, and aerospace. It offers a large number of logic cells, high-speed interfaces, and versatile I/O capabilities, making it suitable for complex and demanding designs.
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Equivalent
The equivalent products of the XC7K325T-3FFG900E chip are the XC7K325T-2FFG900E and XC7K325T-1FFG900E chips from the Xilinx Kintex-7 FPGA family. -
Features
The XC7K325T-3FFG900E is a Xilinx Kintex-7 FPGA, with 325,000 logic cells, 2,160 DSP slices, 22.5 Mb of block RAM, and 840 user I/O pins. It operates at a maximum frequency of 900 MHz and supports various I/O standards, including LVDS and PCI Express. -
Pinout
The XC7K325T-3FFG900E is a field-programmable gate array (FPGA) with a pin count of 900. It belongs to the Xilinx Kintex-7 family and offers high-performance features for various applications, such as telecommunications, industrial control, and embedded systems. The function of the device depends on the design implemented using the FPGA's configurable logic cells, digital signal processing blocks, and transceivers. -
Manufacturer
The manufacturer of the XC7K325T-3FFG900E is Xilinx Inc. It is a technology company specializing in the development and production of programmable logic devices and associated software tools. Xilinx is known for its field-programmable gate arrays (FPGAs) and offers solutions for various industries including telecommunications, automotive, aerospace, and industrial applications. -
Application Field
The XC7K325T-3FFG900E is a field-programmable gate array (FPGA) device in the Xilinx Kintex-7 series. It is commonly used in applications such as industrial automation, telecommunications, aerospace, and defense. It can handle complex digital processing tasks and provide high-performance computing capabilities in various industries.
Datasheet PDF
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