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Intel EP4CE10F17I7N 48HRS

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 423936 10320 256-LBGA

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: EP4CE10F17I7N

Datasheet: EP4CE10F17I7N Datasheet (PDF)

Package/Case: FBGA-256

RoHS Status:

Stock Condition: 3450 pcs, New Original

Product Type: Programmable Logic ICs

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $21.093 $21.093
10 $20.253 $202.530
30 $18.800 $564.000
100 $17.531 $1753.100

In Stock:3450 PCS

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Quick Quote

Please submit RFQ for EP4CE10F17I7N or email to us: Email: [email protected], we will contact you within 12 hours.

EP4CE10F17I7N General Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 423936 10320 256-LBGA

Intel Corp Inventory

Specifications

Parameter Value Parameter Value
Pin Count 256 Package Category BGA
Released Date Oct 27, 2019

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CE10F17I7N chip is a FPGA (Field Programmable Gate Array) from the Altera Cyclone IV series. It has 10,000 logic elements, 288 Kbits of embedded memory, and supports various I/O standards. It is designed for applications requiring high-speed processing and flexibility in customizing logic functions.
  • Equivalent

    Some equivalent products of EP4CE10F17I7N chip are EP4CE10F17I7, EP4CE10F17, EP4CE17F17I7N, and EP4CE17F17. These chips belong to the Altera Cyclone IV series of programmable logic devices. They offer similar features and capabilities, but may have slight differences in terms of performance and specifications.
  • Features

    The EP4CE10F17I7N is a Cyclone IV FPGA featuring 9,600 logic elements, 270 Kbits of embedded memory, and 116 embedded multipliers. It also includes up to 153 user I/Os, PLLs, and support for various communication protocols such as PCIe, LVDS, and DDR.
  • Pinout

    The EP4CE10F17I7N is a 144-pin FPGA with 104 user I/O pins, 2 differential I/O pairs, and various power and ground pins. The function of the FPGA is to provide configurable logic elements and interconnects for designing digital circuits.
  • Manufacturer

    The EP4CE10F17I7N is manufactured by Intel Corporation. Intel Corporation is an American multinational corporation that produces computer processors and other related technologies. It is one of the largest and most influential semiconductor companies in the world, with a focus on innovation and advancing technology.
  • Application Field

    The EP4CE10F17I7N is commonly used in industrial automation, communications, automotive, and consumer electronics. Its features, such as low power consumption, high performance, and flexibility, make it suitable for a wide range of applications in these fields.
  • Package

    The EP4CE10F17I7N chip has a 256-pin FineLine BGA (FBGA) package type and is available in a size of 17x17 mm. It is also offered in an 1152-pin flip chip ball grid array (FCBGA) package form.

Datasheet PDF

Preliminary Specification EP4CE10F17I7N PDF Download

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