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Xilinx XC7A100T-1CSG324C

01440-Cell, BGA-324

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC7A100T-1CSG324C

Datasheet: XC7A100T-1CSG324C Datasheet (PDF)

Package/Case: CSBGA-324

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 6,554 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC7A100T-1CSG324C or email to us: Email: [email protected], we will contact you within 12 hours.

XC7A100T-1CSG324C General Description

The XC7A100T-1CSG324C is a member of Xilinx's Artix-7 FPGA (Field-Programmable Gate Array) family. It features 101,440 logic cells, making it suitable for a wide range of applications including industrial automation, automotive, and communications. The "1CSG324C" designation specifies its package type and temperature range; in this case, it comes in a 324-pin chip-scale package with a commercial-grade temperature range. This FPGA offers various configurable resources including configurable logic blocks (CLBs), block RAM, DSP slices, and I/O ports, providing flexibility for designing complex digital systems. With its integrated features like high-speed serial transceivers and advanced clock management tiles, it enables efficient implementation of high-performance designs. Additionally, it supports popular design entry methods such as VHDL, Verilog, and schematic-based entry, along with Xilinx's Vivado Design Suite for synthesis, implementation, and verification.

XC7A100T-1CSG324C

Features

  • 100,000 logic cells
  • 324-pin CSFBGA package
  • 1V core voltage
  • 28,800 slices
  • Compatible with 1.8V or 3.3V I/O standards
  • 256KB RAM

Application

  • Embedded Systems
  • Industrial Automation
  • Communications
  • Medical Imaging
  • Automotive
  • Aerospace
  • Internet of Things (IoT)
  • Consumer Electronics
  • Networking
  • Digital Signal Processing
Amd Inventory

Specifications

Parameter Value Parameter Value
Product Category FPGA - Field Programmable Gate Array RoHS Details
Series XC7A100T Number of Logic Elements 101440 LE
Adaptive Logic Modules - ALMs 15850 ALM Embedded Memory 4.75 Mbit
Number of I/Os 210 I/O Supply Voltage - Min 950 mV
Supply Voltage - Max 1.05 V Minimum Operating Temperature 0 C
Maximum Operating Temperature + 85 C Mounting Style SMD/SMT
Package / Case CSBGA-324 Brand AMD / Xilinx
Distributed RAM 1188 kbit Embedded Block RAM - EBR 4860 kbit
Moisture Sensitive Yes Number of Logic Array Blocks - LABs 7925 LAB
Operating Supply Voltage 1 V Product Type FPGA - Field Programmable Gate Array
Factory Pack Quantity 1 Subcategory Programmable Logic ICs
Tradename Artix

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC7A100T-1CSG324C is a Field-Programmable Gate Array (FPGA) chip from Xilinx with 101,440 logic cells, 6.6 Mb of block RAM, and 150 DSP slices. It offers high performance and flexibility for a wide range of applications such as networking, industrial control, and automotive. The chip is available in a 324-pin package and is part of the Artix-7 family of FPGAs.
  • Equivalent

    Some equivalent products to the XC7A100T-1CSG324C chip include the XC7A100T-2CSG324C and the XC7A100T-3CSG324C. These chips are part of the Xilinx Artix-7 family and offer similar capabilities and features.
  • Features

    - Part of the Xilinx Artix-7 family - 101,440 logic cells - 6,250 slices - 240 DSP slices - 4.9 Mb block RAM - 16-bit DDR3 memory interface - 75 user I/Os - 16.67 Gbps transceivers - 5,400 kbits of distributed memory
  • Pinout

    The XC7A100T-1CSG324C is an FPGA with 324 pins. Its functions include programmable logic, configurable I/Os, memory blocks, and DSP slices for versatile digital circuit design.
  • Manufacturer

    The XC7A100T-1CSG324C is manufactured by Xilinx, Inc., an American technology company specializing in programmable logic devices and associated technologies. Xilinx is known for its field-programmable gate arrays (FPGAs) and programmable system-on-chip (SoC) solutions, serving industries like aerospace, automotive, telecommunications, and more.
  • Application Field

    The XC7A100T-1CSG324C is commonly used in various applications such as aerospace and defense systems, automotive electronics, industrial automation, telecommunications infrastructure, and medical devices. Its versatility and programmability make it suitable for a wide range of high-performance computing and signal processing tasks.
  • Package

    The XC7A100T-1CSG324C chip is in a Ball Grid Array (BGA) package, with a 324-pin count, and measures approximately 1.0 cm x 1.0 cm in size.

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