Xilinx XC7K325T-1FFG900I
Field Programmable Gate Array, 25475 CLBs, 1098MHz, 326080-Cell, CMOS, PBGA900, FBGA-900
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7K325T-1FFG900I
Datasheet: XC7K325T-1FFG900I Datasheet (PDF)
Package/Case: BGA-900
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3818 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7K325T-1FFG900I General Description
FPGA, KINTEX-7, 400 I/O, FCBGA-900; No. of Logic Blocks:50950; No. of Macrocells:326080Macrocells; FPGA Family:Kintex-7; Logic Case Style:FCBGA; No. of Pins:900Pins; No. of Speed Grades:1; Total RAM Bits:16020Kbit; MSL:- RoHS Compliant: Yes
Features
IC FPGA 500 I/O 900FCBGAIC FPGA 500 I/O 900FCBGASpecifications
Parameter | Value | Parameter | Value |
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Pin Count | 900 | Package Category | BGA |
Released Date | Dec 26, 2018 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7K325T-1FFG900I is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Kintex-7 series and offers a range of features and capabilities for digital signal processing, high-performance computing, and embedded systems development. With its advanced technology and high-speed connectivity options, it is a versatile and powerful tool for various applications in the electronics industry.
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Equivalent
The equivalent products of the XC7K325T-1FFG900I chip are XC7K325T-1FFG1156I, XC7K325T-1FFG1760I, and XC7K325T-1FFG1927I. -
Features
XC7K325T-1FFG900I is a Xilinx Virtex-7 FPGA with 325,200 logic cells, 740 DSP slices, and 900 ball grid array (BGA) package. It offers up to 2,856 I/O pins, 6.6 Gbps transceivers, and supports high-speed serial protocols such as PCIe, SATA, and Ethernet. It also provides 5,600 Kb of block RAM and 33 Mb of distributed RAM. -
Pinout
The XC7K325T-1FFG900I is an FPGA (Field Programmable Gate Array) device manufactured by Xilinx. It has a pin count of 900 and belongs to the Kintex-7 family. The device's specific pin functions may vary depending on the design and configuration implemented by the user. -
Manufacturer
The manufacturer of the XC7K325T-1FFG900I is Xilinx. It is a semiconductor company that specializes in designing and manufacturing programmable logic devices, software development tools, and intellectual property cores. Xilinx is known for its field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs), which are widely used in various industries such as telecommunications, automotive, and aerospace. -
Application Field
The XC7K325T-1FFG900I is an FPGA (Field Programmable Gate Array) device used in various applications including wireless communication, medical imaging, industrial control systems, aerospace and defense, and data processing. Its high-performance and versatile features make it suitable for a wide range of applications requiring high-speed data processing, algorithm acceleration, and complex digital signal processing. -
Package
The XC7K325T-1FFG900I chip has a Ball Grid Array (BGA) package type, Flip-Chip form, and a size of 900 micrometers.
Datasheet PDF
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