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Orders Over
$5000
Infineon BSM150GB60DLC
IGBT Module Single 600 V 180 A 595 W Chassis Mount Module
Brands: Infineon Technologies Corporation
Mfr.Part #: BSM150GB60DLC
Datasheet: BSM150GB60DLC Datasheet (PDF)
Package/Case: 34MM
RoHS Status:
Stock Condition: 3,348 pcs, New Original
Product Type: IGBT Modules
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $194.090 | $194.090 |
| 200 | $75.111 | $15022.200 |
| 500 | $72.472 | $36236.000 |
| 1000 | $71.167 | $71167.000 |
In Stock: 3,348 PCS
BSM150GB60DLC General Description
IGBT Module Single 600 V 180 A 595 W Chassis Mount Module
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Part Life Cycle Code | Transferred | Ihs Manufacturer | EUPEC GMBH & CO KG |
| Package Description | MODULE-7 | Reach Compliance Code | |
| ECCN Code | EAR99 | Case Connection | ISOLATED |
| Collector Current-Max (IC) | 180 A | Collector-Emitter Voltage-Max | 600 V |
| Configuration | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE | Gate-Emitter Voltage-Max | 20 V |
| JESD-30 Code | R-XUFM-X7 | Number of Elements | 2 |
| Number of Terminals | 7 | Operating Temperature-Max | 125 °C |
| Package Body Material | UNSPECIFIED | Package Shape | RECTANGULAR |
| Package Style | FLANGE MOUNT | Polarity/Channel Type | N-CHANNEL |
| Power Dissipation-Max (Abs) | 595 W | Qualification Status | Not Qualified |
| Surface Mount | NO | Terminal Form | UNSPECIFIED |
| Terminal Position | UPPER | Transistor Element Material | SILICON |
| Turn-off Time-Nom (toff) | 260 ns | Turn-on Time-Nom (ton) | 155 ns |
| VCEsat-Max | 2.45 V |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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Step4 :Individual packaging
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The BSM150GB60DLC is a power module chip designed for high power applications, such as motor drives and inverters. It offers a high power density and excellent thermal performance, making it ideal for use in a variety of industrial applications. The chip features low switching losses and high efficiency, contributing to improved performance and energy savings.
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Equivalent
The equivalent products of BSM150GB60DLC chip are Infineon FF150R12KT4, Infineon FF150R12KT3, and Toshiba MG150Q2YS51. These chips are also IGBT modules with similar specifications and characteristics, making them suitable alternatives for various applications. -
Features
1. 150A/600V IGBT module 2. Soft switching TRENCHSTOP™ IGBT4 3. Freewheeling diode with fast recovery 4. NTC temperature sensor 5. High short-circuit rating 6. Low inductive construction 7. Modules can be paralleled for higher current capabilities -
Pinout
BSM150GB60DLC is a dual IGBT module with a pin count of 8 pins. It is designed for use in power electronics applications and features high power efficiency and reliability. Each IGBT module functions as a half-bridge configuration, offering high power output capability. -
Manufacturer
BSM150GB60DLC is manufactured by Infineon Technologies, a German semiconductor manufacturing company. Infineon Technologies specializes in offering semiconductor and system solutions for automotive, industrial, and consumer electronics, as well as chip card and security products. Their products cater to various industries, including automotive, industrial, and power applications. -
Application Field
BSM150GB60DLC is commonly used in various applications such as motor control, renewable energy systems, and power supplies. It is also used in industrial automation, electric vehicles, and traction applications due to its high efficiency, reliability, and performance capabilities. -
Package
The BSM150GB60DLC chip is a IGBT module with a dual half bridge configuration. It is in the 62mm x 32mm form factor and has a package size of 7.6mm x 3mm. This module is designed for high power applications with a current rating of 150A and voltage rating of 600V.
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