Xilinx XC6SLX45-3FGG676C

Part points

• XC6SLX45-3FGG676C is a field-programmable gate array (FPGA) chip produced by Xilinx. It belongs to the Spartan-6 family and offers 45,408 logic cells, making it suitable for various applications requiring high-performance, low-power, and cost-effective solutions. The chip operates at a maximum frequency of 400MHz and includes many advanced features, such as built-in high-speed serial transceiver blocks, on-chip power management, and double data rate (DDR) interfaces.

• Equivalent

  The XC6SLX45-3FGG676C chip has no direct equivalent products. However, it belongs to the Xilinx Spartan-6 family, so other chips within the same family may have similar specifications and functionality.

• Features

  The features of XC6SLX45-3FGG676C include a Spartan-6 FPGA with 45,408 logic cells, 155 DSP slices, and 30,752 memory bits. It has a maximum of 410 user I/O pins, supports up to 800MHz data rates, and has a power supply voltage range of 1.14V to 1.26V. The FPGA comes in a 676-pin FBGA package.

• Pinout

  The XC6SLX45-3FGG676C is a field-programmable gate array (FPGA) with 676 pins and a nominal supply voltage of 3.3V. It is a member of the Spartan-6 LX FPGA family from Xilinx. The specific functions of each pin vary depending on the user's configuration and design requirements.

• Manufacturer

  The XC6SLX45-3FGG676C is manufactured by Xilinx, Inc. Xilinx is a leading American technology company specializing in the development and production of programmable logic devices. They are known for their field-programmable gate arrays (FPGAs) and system-on-chips (SoCs) used in a wide range of electronic devices, including data centers, 5G wireless networks, automotive systems, and more.

• Application Field

  The XC6SLX45-3FGG676C is a field-programmable gate array (FPGA) that can be used in a variety of applications including embedded systems, communications, industrial automation, and aerospace. It provides high-performance processing capabilities, flexible design options, and is capable of implementing complex logic functions.

• Package

  The XC6SLX45-3FGG676C chip is in a package type called FG676, which refers to a fine pitch ball grid array. Its form and size correspond to a 676-ball grid array with a grid pitch, or distance between the center points of adjacent balls, of 1 mm.