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Xilinx XC6SLX16-2FTG256I
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 186 589824 14579 256-LBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC6SLX16-2FTG256I
Datasheet: XC6SLX16-2FTG256I Datasheet (PDF)
Package/Case: BGA256
RoHS Status:
Stock Condition: 2915 pcs, New Original
Product Type: Programmable Logic ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $41.439 | $41.439 |
| 30 | $36.643 | $1099.290 |
In Stock:2915 PCS
XC6SLX16-2FTG256I General Description
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 186 589824 14579 256-LBGA
Features
IC FPGA 186 I/O 256FTBGAIC FPGA 186 I/O 256FTBGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 256 | Package Category | BGA |
| Released Date | Jun 24, 2019 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC6SLX16-2FTG256I is a programmable logic chip from Xilinx. It belongs to the Spartan-6 family of field-programmable gate arrays (FPGAs). It has 16,000 logic cells and is housed in a 256-pin Fine Pitch Ball Grid Array (FBGA) package. The chip is designed for a wide range of applications, offering flexibility and high-performance capabilities when it comes to digital systems design.
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Equivalent
XC6SLX16-2FTG256I is a chip from Xilinx's Spartan-6 LX family. Equivalent products include XC6SLX9-2FTG256I, XC6SLX25-2FTG256I, and XC6SLX45-2FTG256I, which have different logic capacities. These chips are all part of the same series and have similar features and capabilities. -
Features
The XC6SLX16-2FTG256I is a member of the Spartan-6 family of Field-Programmable Gate Arrays (FPGAs) by Xilinx. It has 16,192 logic cells, 1,080 KB of internal block RAM, and 66,560 inputs/outputs. It operates with a maximum frequency of 250 MHz and has a total of 183,695 available system gates. -
Pinout
The pin count of the XC6SLX16-2FTG256I is 256 pins. The device is an FPGA (Field-Programmable Gate Array) with a capacity of 16,080 logic cells. The specific pin functions and assignments can be found in the device datasheet provided by the manufacturer. -
Manufacturer
The manufacturer of the XC6SLX16-2FTG256I is Xilinx. Xilinx is a semiconductor and software design company. They specialize in field-programmable gate array (FPGA) products and related software tools. -
Application Field
The XC6SLX16-2FTG256I is commonly used in a variety of applications, including military and aerospace systems, industrial automation, telecommunications, medical devices, and consumer electronics. Its versatility and features make it suitable for applications that require high-performance, low-power, and programmable logic solutions. -
Package
The XC6SLX16-2FTG256I chip is housed in a FG256 package type, which stands for FineLine BGA with a grid of 0.8 mm. It has 256 balls (solder balls) and the overall size of the chip is 17mm x 17mm.
Datasheet PDF
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