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Xilinx XC6SLX150T-3FGG484I
Spartan-6 FPGA, 540 Max User I/O, Speed Grade-3, Logic Cells 147443, FGG484, RoHS
Brands: AMD Xilinx, Inc
Mfr.Part #: XC6SLX150T-3FGG484I
Datasheet: XC6SLX150T-3FGG484I Datasheet (PDF)
Package/Case: BGA484
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2837 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC6SLX150T-3FGG484I General Description
FPGA, SPARTAN-6, 296 I/O, FPBGA-484; No. of Logic Blocks:23038; No. of Macrocells:147443Macrocells; FPGA Family:Spartan-6; Logic Case Style:FBGA; No. of Pins:484Pins; No. of Speed Grades:3; Total RAM Bits:4824Kbit; MSL:- RoHS Compliant: Yes
Features
- FPGA family: Spartan-6
- FPGA device: XC6SLX150T-3FGG484I
- Number of Logic Cells: 147,443
- Number of DSP Slices: 360
- Clock Management Tiles: 6
- Maximum User I/Os: 484
- Block RAM: 4.8 Mb
- Total Equivalent Gates: 2.6M
Application
- Digital signal processing
- High-performance computing
- Aerospace and defense systems
- Automotive and industrial systems
- Consumer electronics
- Communication systems
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
| RoHS: | Y | Product: | Spartan-6 |
| Number of Logic Elements: | 147443 | Number of I/Os: | 296 I/O |
| Operating Supply Voltage: | 1.2 V | Minimum Operating Temperature: | - 40 C |
| Maximum Operating Temperature: | + 100 C | Mounting Style: | SMD/SMT |
| Package / Case: | FCBGA-484 | Data Rate: | 800 Mb/s |
| Series: | XC6SLX150T | Brand: | Xilinx |
| Distributed RAM: | 1355 kbit | Embedded Block RAM - EBR: | 4824 kbit |
| Maximum Operating Frequency: | 1080 MHz | Moisture Sensitive: | Yes |
| Number of Transceivers: | 8 Transceiver | Product Type: | FPGA - Field Programmable Gate Array |
| Factory Pack Quantity: | 60 | Subcategory: | Programmable Logic ICs |
| Tradename: | Spartan | Tags | XC6SLX150T-3FGG, XC6SLX150T-3F, XC6SLX150T-3, XC6SLX150T, XC6SLX15, XC6SLX1, XC6SLX, XC6SL, XC6S, XC6 |
| Pbfree Code | Yes | Rohs Code | Yes |
| Part Life Cycle Code | Transferred | Ihs Manufacturer | XILINX INC |
| Part Package Code | BGA | Package Description | 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 |
| Pin Count | 484 | Reach Compliance Code | compliant |
| ECCN Code | 3A991.D | HTS Code | 8542.39.00.01 |
| Samacsys Manufacturer | XILINX | Clock Frequency-Max | 862 MHz |
| Combinatorial Delay of a CLB-Max | 0.21 ns | JESD-30 Code | S-PBGA-B484 |
| JESD-609 Code | e1 | Length | 23 mm |
| Moisture Sensitivity Level | 3 | Number of CLBs | 11519 |
| Number of Inputs | 296 | Number of Logic Cells | 147443 |
| Number of Outputs | 296 | Number of Terminals | 484 |
| Operating Temperature-Max | 100 °C | Operating Temperature-Min | -40 °C |
| Organization | 11519 CLBS | Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA | Package Equivalence Code | BGA484,22X22,40 |
| Package Shape | SQUARE | Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 250 | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified | Seated Height-Max | 2.6 mm |
| Supply Voltage-Max | 1.26 V | Supply Voltage-Min | 1.14 V |
| Supply Voltage-Nom | 1.2 V | Surface Mount | YES |
| Technology | CMOS | Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
| Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC6SLX150T-3FGG484I is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It offers 147,433 logic cells and 1,599 I/O pins, making it suitable for complex digital designs. It operates at a core voltage of 1.2V and supports various high-speed interfaces. The chip is used in a wide range of applications, including telecommunications, industrial automation, and aerospace.
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Equivalent
The equivalent products of XC6SLX150T-3FGG484I chip include XC6VLX550T-1FFG1156 chip, XC6VLX240T-1FFG1156 chip, and XC6VLX130T-1FFG1156 chip. -
Features
The XC6SLX150T-3FGG484I is a field-programmable gate array (FPGA) with 150,000 logic cells, capable of running at speeds up to 300 MHz. It features 11,416 available logic slices, 14,240 available flip-flops, and 900 available DSP slices, making it suitable for a wide range of applications. -
Manufacturer
The XC6SLX150T-3FGG484I is manufactured by Xilinx Inc., a technology company specializing in the development of programmable logic devices. Xilinx is renowned for its field-programmable gate arrays (FPGAs) and programmable SoCs, used in a variety of industries including automotive, aerospace, telecommunications, and data centers. -
Application Field
The XC6SLX150T-3FGG484I is a field-programmable gate array (FPGA) commonly used in applications such as high-speed digital signal processing, wireless communication, video and image processing, and aerospace and defense systems. Its high logic capacity and flexible I/O interface make it suitable for a wide range of complex and demanding applications. -
Package
The XC6SLX150T-3FGG484I chip has a package type of FG484, form factor of BGA (Ball Grid Array), and a size of 23x23 mm.
Datasheet PDF
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