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BSM30GP60

Trans IGBT Module N-CH 600V 50A 180W 24-Pin ECONO2-5

ISO14001 ISO9001 DUNS

Brands: EUPEC GMBH & CO KG

Mfr.Part #: BSM30GP60

Datasheet: BSM30GP60 Datasheet (PDF)

Package/Case: EconoPIM2

RoHS Status:

Stock Condition: 7908 pcs, New Original

Product Type: IGBT Modules

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $235.592 $235.592
200 $91.171 $18234.200
500 $87.967 $43983.500
1000 $86.384 $86384.000

In Stock:7908 PCS

- +

Quick Quote

Please submit RFQ for BSM30GP60 or email to us: Email: [email protected], we will contact you within 12 hours.

BSM30GP60 General Description

IGBT Module Full Bridge 600 V 50 A 180 W Chassis Mount Module

Application

POWER CONTROL

Specifications

Parameter Value Parameter Value
Part Life Cycle Code Transferred Ihs Manufacturer EUPEC GMBH & CO KG
Package Description FLANGE MOUNT, R-XUFM-X24 Reach Compliance Code
ECCN Code EAR99 Case Connection ISOLATED
Collector Current-Max (IC) 50 A Collector-Emitter Voltage-Max 600 V
Configuration COMPLEX Gate-Emitter Voltage-Max 20 V
JESD-30 Code R-XUFM-X24 Number of Elements 7
Number of Terminals 24 Operating Temperature-Max 125 °C
Package Body Material UNSPECIFIED Package Shape RECTANGULAR
Package Style FLANGE MOUNT Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 280 W Qualification Status Not Qualified
Surface Mount NO Terminal Form UNSPECIFIED
Terminal Position UPPER Transistor Element Material SILICON
Turn-off Time-Nom (toff) 310 ns Turn-on Time-Nom (ton) 100 ns
VCEsat-Max 2.45 V

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The BSM30GP60 is a power module chip designed for use in various high-frequency switching applications. It integrates multiple power components into a single package, providing enhanced performance, efficiency, and reliability. The chip features low switching losses and high current capabilities, making it ideal for motor drives, renewable energy systems, and other power electronics applications.
  • Equivalent

    The equivalent products of the BSM30GP60 chip include BSM15GD120DN2, BSM15GP120DN2, BSM50GD120DN2, and BSM50GP120DN2.
  • Features

    BSM30GP60 is a 600V, 30A IGBT Power Module with integrated thermal sensor. It has low conduction and switching losses, high ruggedness and reliability, and compact size for easy mounting and replacement. It offers excellent thermal performance and high efficiency in various power electronic applications.
  • Pinout

    The BSM30GP60 is a 30 amp, 600 volt IGBT module with 7 pins. Pin functions include gate, emitter, collector, positive and negative terminals, and two auxiliary pins.
  • Manufacturer

    Infineon Technologies is the manufacturer of the BSM30GP60. Infineon Technologies is a German semiconductor company that produces various types of semiconductor products, including power modules like the BSM30GP60. The company focuses on providing solutions for various industries, such as automotive, industrial, and power management.
  • Application Field

    The BSM30GP60 is a high voltage insulated gate bipolar transistor (IGBT) used in power electronic applications such as motor drives, inverters, and converters. Its low on-state voltage drop and high switching speed make it suitable for high power density applications requiring efficient and reliable power switching.
  • Package

    The BSM30GP60 chip is typically packaged in a module form known as a Power Module. It usually comes in a standard size of around 30 x 50 mm. The chip itself is a IGBT (Insulated Gate Bipolar Transistor) and has a current rating of 30A and 600V.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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