BSM30GP60
Trans IGBT Module N-CH 600V 50A 180W 24-Pin ECONO2-5
Brands: EUPEC GMBH & CO KG
Mfr.Part #: BSM30GP60
Datasheet: BSM30GP60 Datasheet (PDF)
Package/Case: EconoPIM2
RoHS Status:
Stock Condition: 7908 pcs, New Original
Product Type: IGBT Modules
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1
*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $235.592 | $235.592 |
200 | $91.171 | $18234.200 |
500 | $87.967 | $43983.500 |
1000 | $86.384 | $86384.000 |
In Stock:7908 PCS
BSM30GP60 General Description
IGBT Module Full Bridge 600 V 50 A 180 W Chassis Mount Module
Application
POWER CONTROLSpecifications
Parameter | Value | Parameter | Value |
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Part Life Cycle Code | Transferred | Ihs Manufacturer | EUPEC GMBH & CO KG |
Package Description | FLANGE MOUNT, R-XUFM-X24 | Reach Compliance Code | |
ECCN Code | EAR99 | Case Connection | ISOLATED |
Collector Current-Max (IC) | 50 A | Collector-Emitter Voltage-Max | 600 V |
Configuration | COMPLEX | Gate-Emitter Voltage-Max | 20 V |
JESD-30 Code | R-XUFM-X24 | Number of Elements | 7 |
Number of Terminals | 24 | Operating Temperature-Max | 125 °C |
Package Body Material | UNSPECIFIED | Package Shape | RECTANGULAR |
Package Style | FLANGE MOUNT | Polarity/Channel Type | N-CHANNEL |
Power Dissipation-Max (Abs) | 280 W | Qualification Status | Not Qualified |
Surface Mount | NO | Terminal Form | UNSPECIFIED |
Terminal Position | UPPER | Transistor Element Material | SILICON |
Turn-off Time-Nom (toff) | 310 ns | Turn-on Time-Nom (ton) | 100 ns |
VCEsat-Max | 2.45 V |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The BSM30GP60 is a power module chip designed for use in various high-frequency switching applications. It integrates multiple power components into a single package, providing enhanced performance, efficiency, and reliability. The chip features low switching losses and high current capabilities, making it ideal for motor drives, renewable energy systems, and other power electronics applications.
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Equivalent
The equivalent products of the BSM30GP60 chip include BSM15GD120DN2, BSM15GP120DN2, BSM50GD120DN2, and BSM50GP120DN2. -
Features
BSM30GP60 is a 600V, 30A IGBT Power Module with integrated thermal sensor. It has low conduction and switching losses, high ruggedness and reliability, and compact size for easy mounting and replacement. It offers excellent thermal performance and high efficiency in various power electronic applications. -
Pinout
The BSM30GP60 is a 30 amp, 600 volt IGBT module with 7 pins. Pin functions include gate, emitter, collector, positive and negative terminals, and two auxiliary pins. -
Manufacturer
Infineon Technologies is the manufacturer of the BSM30GP60. Infineon Technologies is a German semiconductor company that produces various types of semiconductor products, including power modules like the BSM30GP60. The company focuses on providing solutions for various industries, such as automotive, industrial, and power management. -
Application Field
The BSM30GP60 is a high voltage insulated gate bipolar transistor (IGBT) used in power electronic applications such as motor drives, inverters, and converters. Its low on-state voltage drop and high switching speed make it suitable for high power density applications requiring efficient and reliable power switching. -
Package
The BSM30GP60 chip is typically packaged in a module form known as a Power Module. It usually comes in a standard size of around 30 x 50 mm. The chip itself is a IGBT (Insulated Gate Bipolar Transistor) and has a current rating of 30A and 600V.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products