Xilinx XC6SLX100-3FGG484I

Part points

• The XC6SLX100-3FGG484I is a Field-Programmable Gate Array (FPGA) chip manufactured by Xilinx. It belongs to the Spartan-6 family and offers advanced features and capabilities suitable for a wide range of applications. The chip has a density of 101,261 logic cells and 5,016 slices, along with various I/O interfaces. It operates at 3.3V and is designed to provide high-performance and low-power consumption.

• Equivalent

  The equivalent products of the XC6SLX100-3FGG484I chip include the XC6SLX100-3FGG484, XC6SLX100-3FGG484C, XC6SLX100-3FGG484E, XC6SLX100-3FGG484I, XC6SLX100-3FGG484M, and XC6SLX100-3FGG484P.

• Features

  The XC6SLX100-3FGG484I is an FPGA from Xilinx. It has a capacity of 100,000 logic cells, a maximum speed of 375MHz, and supports up to 784 I/Os. It has integrated RAM, DSP slices, and PCIe connectivity. Additionally, it offers low power consumption and is designed for high-performance applications.

• Pinout

  The XC6SLX100-3FGG484I is an FPGA (field-programmable gate array) with a pin count of 484. The specific functions of each pin can vary depending on the configuration and programming of the device within the constraints set by the manufacturer.

• Manufacturer

  The manufacturer of the XC6SLX100-3FGG484I is Xilinx. Xilinx is a semiconductor company that specializes in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs) and system on chips (SoCs). They provide solutions for various industries, including telecommunications, automotive, aerospace, and many others.

• Application Field

  The XC6SLX100-3FGG484I is a field-programmable gate array (FPGA) ideal for use in applications such as wireless communication, automotive, medical equipment, industrial control systems, and consumer electronics. Its high-speed processing capability, low power consumption, and versatile I/O capabilities make it suitable for a wide range of applications requiring programmable logic.

• Package

  The XC6SLX100-3FGG484I chip is packaged in a FG484 package type. The form of the chip is BGA (Ball Grid Array), which means it has an array of solder balls on the bottom side. The size of the chip is 23mm x 23mm.