Xilinx XC5VLX50-3FFG676C

Part points

• The XC5VLX50-3FFG676C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Virtex-5 family and offers advanced features and high performance for various applications. The chip operates at a speed grade of -3 and has a package configuration of FF676. It is designed for use in demanding systems that require programmable logic solutions.

• Equivalent

  The equivalent products of the XC5VLX50-3FFG676C chip are the XC5VLX50-1FFG676C and XC5VLX50-2FFG676C chips from Xilinx's Virtex-5 LX FPGA series.

• Features

  The XC5VLX50-3FFG676C is a Virtex-5 LX FPGA with a capacity of 50,615 logic cells, operating at a maximum speed of 550MHz. It has 36,864 distributed RAM bits and 640KB block RAM. Additionally, it provides 32 I/O standards, four clock management tiles, and supports embedded multipliers up to 25x18 bits.

• Pinout

  The XC5VLX50-3FFG676C is a Field Programmable Gate Array (FPGA) with a pin count of 676. It is part of the Virtex-5 family by Xilinx and operates with a core voltage of 1.0V. The specific pin functions can be found in the datasheet provided by the manufacturer.

• Manufacturer

  The manufacturer of the XC5VLX50-3FFG676C is Xilinx Inc. Xilinx is an American technology company specializing in the design and production of programmable logic devices and associated software. They are known for their field-programmable gate arrays (FPGAs) and provide solutions for a variety of industries such as telecommunications, automotive, aerospace, and data centers.

• Application Field

  The XC5VLX50-3FFG676C is an FPGA (Field Programmable Gate Array) and can be used in various application areas such as telecommunications, networking, compute-intensive applications, video processing, industrial control systems, and high-performance computing. It is designed to provide high processing performance, flexibility, and scalability for a wide range of applications in these fields.

• Package

  The XC5VLX50-3FFG676C chip is packaged in a FG676 package type, has a size of 27mm x 27mm, and is in a flip-chip form.