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Intel 10M08SAM153I7G

MAX® 10 Field Programmable Gate Array (FPGA) IC 112 387072 8000 153-VFBGA

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: 10M08SAM153I7G

Datasheet: 10M08SAM153I7G Datasheet (PDF)

Package/Case: 153-VFBGA

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2463 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for 10M08SAM153I7G or email to us: Email: [email protected], we will contact you within 12 hours.

Features

Supply Voltage - Max: 3.465 V
Maximum Operating Temperature: +100°C
Number of I/Os: 112 I/O
Package / Case: MBGA-153
Supply Voltage - Min: 2.85 V
Moisture Sensitive: Yes
Operating Supply Voltage: 3 V, 3.3 V
Minimum Operating Temperature: -40°C
Manufacturer: Intel
Maximum Operating Frequency: 450 MHz
Number of Logic Elements: 8000 LE
Embedded Memory: 378 kbit
Product Category: FPGA - Field Programmable Gate Array
Mounting Style: SMD/SMT
Number of Logic Array Blocks - LABs: 500 LAB

Intel Corp Inventory

Specifications

Parameter Value Parameter Value
Pin Count 153 Package Category BGA
Released Date Jan 30, 2020

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The 10M08SAM153I7G chip is a microchip used in electronic devices that require high-performance and low-power consumption. It is part of the Intel MAX 10 FPGA family and offers various features, including programmable logic and memory, analog-to-digital converters, and embedded processing capabilities. This chip is suitable for applications such as industrial automation, automotive, and IoT devices.
  • Pinout

    The 10M08SAM153I7G is a Field-Programmable Gate Array (FPGA) with a pin count of 153. It is used for rapid digital logic development and prototyping. The specific functions of the pins would depend on the configuration and programming of the FPGA.
  • Manufacturer

    The manufacturer of the 10M08SAM153I7G is Intel. Intel is a multinational technology company that specializes in the design and manufacture of semiconductors, microprocessors, and other computer-related technology products.
  • Application Field

    The 10M08SAM153I7G is a low-cost, low-power, non-volatile flash-based FPGA from Intel. It is commonly used in applications such as industrial control systems, Internet of Things (IoT) devices, automotive electronics, and handheld devices. It offers a flexible and efficient solution for implementing various functions such as digital signal processing, control circuitry, data acquisition, and more.
  • Package

    The package type of the 10M08SAM153I7G chip is a surface mount package (SMP). The form factor is 153-ball micro fine BGA (Ball Grid Array), and the size is approximately 10mm x 10mm.

Datasheet PDF

Preliminary Specification 10M08SAM153I7G PDF Download

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  • quantity

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