Xilinx XC4VSX55-10FFG1148C

Part points

• XC4VSX55-10FFG1148C is a field-programmable gate array (FPGA) chip developed by Xilinx. It belongs to the Virtex-4 family and has 55,000 logic cells, making it suitable for complex digital designs. The chip has a maximum speed grade of 10, with a total of 1,148 I/O pins available. It offers various advanced features and customizable resources, allowing for flexible and efficient implementation of high-performance applications.

• Equivalent

  The equivalent products of the XC4VSX55-10FFG1148C chip are XC4VSX55-10FF1148C, XC4VSX55-10FF1148CES, XC4VSX55-10FF1148I, XC4VSX55-10FFG1148I and XC4VSX55-10FFG1148CES.

• Features

  The XC4VSX55-10FFG1148C is an FPGA (Field-Programmable Gate Array) from Xilinx. Its features include 55,000 logic cells, 698 I/O pins, 4.8 Mb of embedded memory, support for multiple high-speed serial interfaces, and low power consumption. It operates at a voltage of 1.2V and has a speed grade of -10 (meaning it can operate at a maximum frequency of 250 MHz).

• Pinout

  The XC4VSX55-10FFG1148C is a FPGA (Field-Programmable Gate Array) with 1148 pins. The pin functions are diverse and depend on the system design and configuration. The specific function of each pin can be found in the device datasheet provided by the manufacturer.

• Manufacturer

  The manufacturer of XC4VSX55-10FFG1148C is Xilinx. It is an American technology company known for its development and production of programmable logic devices, including field-programmable gate arrays (FPGAs) and other specialized integrated circuits.

• Application Field

  The XC4VSX55-10FFG1148C is a field-programmable gate array (FPGA) that can be used in various high-performance applications such as telecommunications, networking, and digital signal processing. It can also be utilized in aerospace and defense systems, medical imaging equipment, video and graphics processing, and scientific research.

• Package

  The XC4VSX55-10FFG1148C chip is available in a Ball Grid Array (BGA) package type. It has a Ball Pitch (distance between each ball) of 1.0 mm and a ball count of 1148. The chip measures 31 x 31 mm in size.