Xilinx XC3S700A-4FTG256I
Spartan®-3A Field Programmable Gate Array (FPGA) IC 161 368640 13248 256-LBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S700A-4FTG256I
Datasheet: XC3S700A-4FTG256I Datasheet (PDF)
Package/Case: 256-FTBGA
RoHS Status:
Stock Condition: 2858 pcs, New Original
Product Type: Programmable Logic ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
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1 | $52.071 | $52.071 |
30 | $44.049 | $1321.470 |
In Stock:2858 PCS
XC3S700A-4FTG256I General Description
Spartan®-3A Field Programmable Gate Array (FPGA) IC 161 368640 13248 256-LBGA
Features
IC FPGA 161 I/O 256FTBGAIC FPGA 161 I/O 256FTBGASpecifications
Parameter | Value | Parameter | Value |
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Pin Count | 256 | Package Category | BGA |
Released Date | Feb 8, 2020 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
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Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC3S700A-4FTG256I is a Field Programmable Gate Array (FPGA) chip produced by Xilinx. It offers 700,000 programmable logic cells and a range of configurable features, making it suitable for a variety of applications such as digital signal processing, high-speed communication, and embedded systems. The chip is part of the Spartan-3A family and is known for its flexibility, low power consumption, and cost-effectiveness.
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Equivalent
XC3S700A-4FTG256I is a model of the Xilinx Spartan-3A field-programmable gate array (FPGA) family. There are no direct equivalent products as each model has its own unique specifications and features. However, the Spartan-3A family includes various other models with similar capabilities but different configuration options. -
Features
The XC3S700A-4FTG256I is an FPGA (Field Programmable Gate Array) from Xilinx. It has 700,000 system gates, operates at a speed grade of -4, and comes in a FTG256 package. This FPGA offers advanced programmability, versatility, and reliability for various applications such as digital signal processing, networking, and system integration. -
Pinout
The XC3S700A-4FTG256I is a 256-ball, 700K gate (logic cells) FPGA (Field Programmable Gate Array) with a pin count of 256. It provides electronic circuitry for programmable logic. Each pin has a specific function, such as input, output, or control, which is determined by the designer during programming. -
Manufacturer
XC3S700A-4FTG256I is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. Xilinx is a leading American semiconductor company specializing in programmable logic devices and related technology. They are known for their FPGA chips, which allow users to customize digital circuits, making them suitable for a wide range of applications in various industries such as telecom, automotive, and aerospace. -
Application Field
The XC3S700A-4FTG256I FPGA chip is commonly used in various applications such as telecommunications, automotive systems, medical devices, industrial automation, and consumer electronics. Its high performance, low power consumption, and flexible design make it suitable for a wide range of applications requiring complex digital signal processing, data processing, and control functions. -
Package
The XC3S700A-4FTG256I chip has a Fine-Pitch Ball Grid Array (FBGA) package type, with 256 pins in a Grid Array form, and a Compact size.
Datasheet PDF
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