Intel 10M25DAF484C8G
MAX® 10 Field Programmable Gate Array (FPGA) IC 360 691200 25000 484-BGA
Brands: Intel Corp
Mfr.Part #: 10M25DAF484C8G
Datasheet: 10M25DAF484C8G Datasheet (PDF)
Package/Case: 484-BGA
Product Type: Programmable Logic ICs
10M25DAF484C8G General Description
MAX® 10 Field Programmable Gate Array (FPGA) IC 360 691200 25000 484-BGA
Specifications
Parameter | Value | Parameter | Value |
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Pin Count | 484 | Package Category | BGA |
Released Date | Mar 11, 2021 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The 10M25DAF484C8G chip is an electronic component used for embedded systems and design projects. It features 25,000 logic elements, 484 pins, and operates on 10-micron technology. This chip is commonly used for applications that require high-performance computing, such as automotive, industrial control, and communication systems.
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Features
The features of 10M25DAF484C8G are a capacity of 10M25 logic elements, a package size of 484-ball fine pitch ball grid array (FPBGA), and a speed grade of -8. -
Pinout
The 10M25DAF484C8G has a pin count of 484 and is a field-programmable gate array (FPGA) device. Its specific pin functions may vary, but generally include input/output pins for various signals, clock, power, ground, configuration, and programming pins for configuring and loading the FPGA logic. -
Manufacturer
The manufacturer of the 10M25DAF484C8G is Intel. Intel is an American multinational corporation that focuses on designing and manufacturing semiconductor chips, including microprocessors, for various devices such as computers, servers, and other electronic devices. -
Application Field
The 10M25DAF484C8G FPGA can be used in various application areas, including telecommunications, industrial automation, aerospace and defense, medical imaging, and automotive systems. It is especially suitable for applications that require high-performance processing, low power consumption, and flexibility for design customization. -
Package
The package type of the 10M25DAF484C8G chip is BGA (Ball Grid Array), the form is square, and the size is 23mm x 23mm.
Datasheet PDF
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