Xilinx XCKU060-2FFVA1156E
FPGA Kintex UltraScale Family 580440 Cells 20nm Technology 0.95V 1156-Pin FCBGA Tray
Brands: AMD Xilinx, Inc
Mfr.Part #: XCKU060-2FFVA1156E
Datasheet: XCKU060-2FFVA1156E Datasheet (PDF)
Package/Case: FCBGA/1
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2049 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXCKU060-2FFVA1156E General Description
Fpga, Kintex Ultrascale, 520 I/O, Fcbga; No. Of Logic Blocks:331680; No. Of Macrocells:725550; Fpga Family:Kintex Ultrascale; Logic Case Style:Fcbga; No. Of Pins:1156Pins; No. Of Speed Grades:-2; Total Ram Bits:38000Kbit; No. Of Rohs Compliant: Yes |Amd Xilinx XCKU060-2FFVA1156E
Features
IC FPGA 520 I/O 1156FCBGAIC FPGA 520 I/O 1156FCBGASpecifications
Parameter | Value | Parameter | Value |
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Pin Count | 1156 | Package Category | BGA |
Released Date | Sep 3, 2018 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XCKU060-2FFVA1156E is a high-performance field-programmable gate array (FPGA) chip from Xilinx. It features a 20nm process technology, up to 673,280 logic cells, and 3600 DSP slices. This chip is ideal for applications requiring high-speed processing capabilities and flexible programmability.
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Equivalent
XCKU060-2FFVA1156E chip is equivalent to XCKU060-2FFVA1156I, XCKU095-2FFVA1156E, and XCKU095-2FFVA1156I chips from the same manufacturer. -
Features
The XCKU060-2FFVA1156E is a Xilinx Kintex UltraScale FPGA with 196,000 logic cells, 6.6 Mb of RAM, 2400 DSP slices, and 60 12.5 Gb/s transceivers. It features a -2 speed grade and is available in a FFVA1156 package. This FPGA is ideal for high-performance applications requiring extensive processing capabilities. -
Pinout
The XCKU060-2FFVA1156E is a Xilinx Kintex UltraScale FPGA with 1156 pins. It is a high-end FPGA offering high-performance processing and interfacing capabilities for various applications such as telecommunications, automotive, and industrial. -
Manufacturer
The manufacturer of XCKU060-2FFVA1156E is Xilinx, Inc. It is an American technology company that specializes in developing and manufacturing programmable logic devices and associated technologies. Xilinx is a leading provider of field-programmable gate arrays (FPGAs) and related software tools to enable customers to design and implement advanced digital systems. -
Application Field
Industrial control, automotive, aerospace, telecommunications, data processing, medical equipment, and defense applications. The XCKU060-2FFVA1156E is a high-performance FPGA suitable for a wide range of applications that require high processing power, low latency, and flexibility for customization and reconfiguration. -
Package
The XCKU060-2FFVA1156E chip is packaged in a Flip Chip Ball Grid Array (FFVA) package. It is in form factor 1156-FCBGA and has a size of 31mm x 31mm.
Datasheet PDF
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