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Xilinx XC3S500E-5FTG256C 48HRS

Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 368640 10476 256-LBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S500E-5FTG256C

Datasheet: XC3S500E-5FTG256C Datasheet (PDF)

Package/Case: BGA-256

RoHS Status:

Stock Condition: 2559 pcs, New Original

Product Type: Programmable Logic ICs

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $333.809 $333.809
180 $133.193 $23974.740
540 $128.741 $69520.140
990 $126.542 $125276.580

In Stock:2559 PCS

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Quick Quote

Please submit RFQ for XC3S500E-5FTG256C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S500E-5FTG256C General Description

Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 368640 10476 256-LBGA

xc3s500e-5ftg256c

Features

  • 500,000 system gates
  • 5ns clock-to-output delay
  • 1.2V core voltage
  • 3.3V and 2.5V I/O standards
  • 256-pin fine pitch ball grid array (FBGA) package
  • Built-in serial configuration PROM

Application

  • Embedded systems
  • Digital signal processing (DSP)
  • Communications systems
  • Industrial control systems
  • High-performance computing
  • Aerospace and defense systems
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Mount Surface Mount Number of Pins 256
Max Operating Temperature 85 °C Min Operating Temperature 0 °C
Number of Gates 500000 Number of I/Os 190
Number of Logic Blocks (LABs) 1164 Number of Logic Elements/Cells 10476
Number of Registers 9312 Operating Supply Voltage 1.2 V
RAM Size 45 kB

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S500E-5FTG256C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   EP3C40F780C8N

Brands :  

Package :  

Description :   EP3C40F780C8N

Part points

  • The XC3S500E-5FTG256C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Spartan-3E FPGA family and is available in the FT256 package. The chip offers 500,000 system gates and 7,292 logic cells, making it suitable for various applications such as digital signal processing, automotive electronics, and industrial automation.
  • Equivalent

    Some equivalent products to the XC3S500E-5FTG256C chip include the XC3S500E-4FGG320C, XC3S500E-4FTG256I, XC3S500E-5FTG256I, and the XC3S500E-4FGG320I. These chips are all within the same family and have similar specifications and functionalities.
  • Features

    XC3S500E-5FTG256C is a field-programmable gate array (FPGA) device with 500K System Gates, 17176 Logic Cells, and 360 User I/Os. It features high-performance, low-power consumption, and reliable performance. It operates on a 5V power supply and has a 256-ball fine-pitch BGA package. It is designed for applications requiring high-speed, real-time processing capabilities.
  • Pinout

    The XC3S500E-5FTG256C is a Field-Programmable Gate Array (FPGA) with a pin count of 256. The pins serve various functions like input/output connections, power supply, configuration, clock signals, and control signals. These pins allow the user to configure the FPGA and implement desired digital logic circuits and functionalities.
  • Manufacturer

    The manufacturer of the XC3S500E-5FTG256C is Xilinx Inc. It is a leading American technology company specializing in the design and development of programmable logic devices and associated technologies.
  • Application Field

    The XC3S500E-5FTG256C is an FPGA (Field Programmable Gate Array) device. It can be used in a variety of application areas including telecommunications, industrial automation, medical devices, aerospace and defense systems, and consumer electronics. Its flexibility, high performance, and reprogrammability make it suitable for a wide range of applications.
  • Package

    The XC3S500E-5FTG256C chip is available in a 256-ball grid array (BGA) package type. It has a total size of 17x17 mm (256 square mm) and conforms to the Enhanced BGA package form.

Datasheet PDF

Preliminary Specification XC3S500E-5FTG256C PDF Download

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