Xilinx XC3S500E-5FTG256C
Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 368640 10476 256-LBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S500E-5FTG256C
Datasheet: XC3S500E-5FTG256C Datasheet (PDF)
Package/Case: BGA-256
RoHS Status:
Stock Condition: 2559 pcs, New Original
Product Type: Programmable Logic ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $333.809 | $333.809 |
180 | $133.193 | $23974.740 |
540 | $128.741 | $69520.140 |
990 | $126.542 | $125276.580 |
In Stock:2559 PCS
XC3S500E-5FTG256C General Description
Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 368640 10476 256-LBGA
Features
- 500,000 system gates
- 5ns clock-to-output delay
- 1.2V core voltage
- 3.3V and 2.5V I/O standards
- 256-pin fine pitch ball grid array (FBGA) package
- Built-in serial configuration PROM
Application
- Embedded systems
- Digital signal processing (DSP)
- Communications systems
- Industrial control systems
- High-performance computing
- Aerospace and defense systems
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Mount | Surface Mount | Number of Pins | 256 |
Max Operating Temperature | 85 °C | Min Operating Temperature | 0 °C |
Number of Gates | 500000 | Number of I/Os | 190 |
Number of Logic Blocks (LABs) | 1164 | Number of Logic Elements/Cells | 10476 |
Number of Registers | 9312 | Operating Supply Voltage | 1.2 V |
RAM Size | 45 kB |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S500E-5FTG256C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part points
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The XC3S500E-5FTG256C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Spartan-3E FPGA family and is available in the FT256 package. The chip offers 500,000 system gates and 7,292 logic cells, making it suitable for various applications such as digital signal processing, automotive electronics, and industrial automation.
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Equivalent
Some equivalent products to the XC3S500E-5FTG256C chip include the XC3S500E-4FGG320C, XC3S500E-4FTG256I, XC3S500E-5FTG256I, and the XC3S500E-4FGG320I. These chips are all within the same family and have similar specifications and functionalities. -
Features
XC3S500E-5FTG256C is a field-programmable gate array (FPGA) device with 500K System Gates, 17176 Logic Cells, and 360 User I/Os. It features high-performance, low-power consumption, and reliable performance. It operates on a 5V power supply and has a 256-ball fine-pitch BGA package. It is designed for applications requiring high-speed, real-time processing capabilities. -
Pinout
The XC3S500E-5FTG256C is a Field-Programmable Gate Array (FPGA) with a pin count of 256. The pins serve various functions like input/output connections, power supply, configuration, clock signals, and control signals. These pins allow the user to configure the FPGA and implement desired digital logic circuits and functionalities. -
Manufacturer
The manufacturer of the XC3S500E-5FTG256C is Xilinx Inc. It is a leading American technology company specializing in the design and development of programmable logic devices and associated technologies. -
Application Field
The XC3S500E-5FTG256C is an FPGA (Field Programmable Gate Array) device. It can be used in a variety of application areas including telecommunications, industrial automation, medical devices, aerospace and defense systems, and consumer electronics. Its flexibility, high performance, and reprogrammability make it suitable for a wide range of applications. -
Package
The XC3S500E-5FTG256C chip is available in a 256-ball grid array (BGA) package type. It has a total size of 17x17 mm (256 square mm) and conforms to the Enhanced BGA package form.
Datasheet PDF
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