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ON FOD817B3SD

Four-pin package

ISO14001 ISO9001 DUNS

Brands: Onsemi

Mfr.Part #: FOD817B3SD

Datasheet: FOD817B3SD Datasheet (PDF)

Package/Case: PDIP-4 GW

Product Type: Optocouplers / Photocouplers

RoHS Status:

Stock Condition: 3129 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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FOD817B3SD General Description

The FOD817B3SD is a high-speed logic gate optocoupler manufactured by Fairchild Semiconductor. It consists of an infrared emitting diode optically coupled with a phototransistor detector in a compact 4-pin SOP package. The device is designed for high-speed digital interfacing applications where isolation is required.The FOD817B3SD has a minimum isolation voltage of 5000Vrms, ensuring reliable electrical separation between the input and output circuits. It operates over a wide temperature range of -40°C to 85°C, making it suitable for use in a variety of environments.This optocoupler has a low input current of 5mA and a maximum output voltage of 80V. It features a high-speed switching time of 5μs, allowing for fast data transmission with minimal delay.

Features

  • FOD817B3SD is an optocoupler with a phototransistor output
  • It has a high current transfer ratio (CTR) of 50-600%
  • The device is designed for high transient immunity
  • It has a wide operating temperature range of -40°C to 100°C
  • FOD817B3SD is RoHS compliant
  • Application

  • The FOD817B3SD optocoupler can be used in various applications, including industrial automation, motor control, renewable energy systems, and power supply circuits
  • It is particularly well-suited for isolated communication, signal isolation, and voltage sensing in high-voltage and high-speed applications
  • Specifications

    Parameter Value Parameter Value
    Status Active Compliance PbAHP
    Package Type PDIP-4 GW Case Outline 709AH
    MSL Type 1 MSL Temp (°C) 260
    Container Type REEL Container Qty. 1000
    ON Target N Channels 1
    CTR (Min) (%) 130 CTR (Max) (%) 260
    CTR tested @ IF (mA) 5 VCE(sat) (Max) (V) 0.2
    BVCEO (Min) (V) 70 BVECO (Min) (V) 6
    VISO (Min) (V) 5000 TOPR (Min) (°C) -55
    TOPR (Max) (°C) 110

    Shipping

    Shipping Type Ship Fee Lead Time
    DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
    Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
    UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
    TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
    EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
    REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

    Processing Time:Shipping fee depend on different zone and country.

    Payment

    Terms of payment Hand Fee
    Wire Transfer Wire Transfer charge US$30.00 banking fee.
    Paypal Paypal charge 4.0% service fee.
    Credit Card Credit Card charge 3.5% service fee.
    Western Union Western Union charge US.00 banking fee.
    Money Gram Money Gram charge US$0.00 banking fee.

    Guarantees

    1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

    2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

    Packing

    • Product

      Step1 :Product

    • Vacuum packaging

      Step2 :Vacuum packaging

    • Anti-static bag

      Step3 :Anti-static bag

    • Individual packaging

      Step4 :Individual packaging

    • Packaging boxes

      Step5 :Packaging boxes

    • bar-code shipping tag

      Step6 :bar-code shipping tag

    All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

    Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

    We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

    After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

    • ESD
    • ESD

    Part points

    • The FOD817B3SD chip is an optocoupler device that combines a phototransistor and a gallium arsenide infrared emitting diode. It is used for isolating electronic circuits in noisy environments, providing electrical insulation between input and output signals, and enabling communication between different voltage levels. The chip has a compact size and low power consumption, making it suitable for various applications in industrial, automotive, and consumer electronics.
    • Equivalent

      Some equivalent products of the FOD817B3SD chip include the FOD817A3SD, FOD817C3SD, FOD817D3SD, and FOD817E3SD. These devices are also optoisolators (or optocouplers) with similar specifications and performance characteristics.
    • Features

      The FOD817B3SD is a high-speed phototransistor optocoupler. It features a GaAs infrared emitting diode and NPN silicon phototransistor, capable of transferring electrical signals between two isolated circuits. Its features include a low input current, high collector-emitter voltage, and fast switching speeds.
    • Pinout

      The FOD817B3SD is an optocoupler with a 4-pin DIP (Dual Inline Package). The pins have the following functions: Pin 1 is the anode of the IR LED, Pin 2 is the cathode of the IR LED, Pin 3 is the collector of the phototransistor, and Pin 4 is the emitter of the phototransistor.
    • Manufacturer

      The manufacturer of the FOD817B3SD is Fairchild Semiconductor. It is a global company that specializes in the design, development, and production of power and discrete semiconductor technologies.
    • Application Field

      The FOD817B3SD can be used in various application areas, including industrial automation, motor control, power supplies, medical equipment, and automotive systems.
    • Package

      The FOD817B3SD chip is in a 4-pin DIP (Dual Inline Package) package type. The package form is molded, and its size is approximately 9.9mm x 6.9mm x 3.2mm.

    Datasheet PDF

    Preliminary Specification FOD817B3SD PDF Download

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