Xilinx XC3S5000-5FG900C

Part points

• The XC3S5000-5FG900C is an FPGA chip developed by Xilinx. It is part of the Spartan-3 family and is designed to provide high-performance, low-cost solutions for various applications. With a 3.3V core voltage, it offers 5,000 logic cells and operates at a maximum frequency of 133 MHz. It is commonly used in a range of electronic devices and systems that require programmable logic capabilities.

• Equivalent

  The equivalent products of the XC3S5000-5FG900C chip are the XQ3S5000-5FG900C, the XC3S5000-5FG900I, and the XC3S5000-5FG900 chips.

• Features

  The XC3S5000-5FG900C is a field-programmable gate array (FPGA) from the Spartan-3 series. It has 3,888 slices, 320 DSP slices, and 26,304 logic cells. It operates with a maximum frequency of 677 MHz and provides 30,192 available logic cells.

• Pinout

  The XC3S5000-5FG900C is an FPGA (Field-Programmable Gate Array) device from Xilinx that has 900 pins. It is used for configurable digital logic applications, with features such as programmable interconnects and configurable logic blocks for customizable functionality.

• Manufacturer

  The XC3S5000-5FG900C is manufactured by Xilinx Inc. Xilinx is an American technology company specializing in the development and production of programmable logic devices. It is widely known for its flagship product, the field-programmable gate array (FPGA), used in various applications such as data centers, telecommunications, automotive, and aerospace industries.

• Application Field

  The XC3S5000-5FG900C is a field-programmable gate array (FPGA) with a high logic density, making it suitable for complex digital designs in various application areas. These include telecommunications, networking equipment, high-performance computing, aerospace and defense systems, industrial automation, video processing, and scientific research.

• Package

  The XC3S5000-5FG900C chip is in the FG900 package type, BGA form, with a size of 900 pins.