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Xilinx XC3S4000-4FGG900C 48HRS

Spartan®-3 Field Programmable Gate Array (FPGA) IC 633 1769472 62208 900-BBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S4000-4FGG900C

Datasheet: XC3S4000-4FGG900C Datasheet (PDF)

Package/Case: FBGA-900

RoHS Status:

Stock Condition: 2034 pcs, New Original

Product Type: Programmable Logic ICs

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $913.953 $913.953
189 $364.673 $68923.197
513 $352.488 $180826.344
999 $346.466 $346119.534

In Stock:2034 PCS

- +

Quick Quote

Please submit RFQ for XC3S4000-4FGG900C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S4000-4FGG900C General Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 633 1769472 62208 900-BBGA

xc3s4000-4fgg900c

Features

  • It belongs to the Spartan-3 family of FPGAs and has a capacity of 4 million system gates.
  • It has 4,608 slices, each of which contains four 6-input LUTs and 8 flip-flops.
  • It has 216 block RAMs, each of which is 18 Kb in size, and 32 Digital Signal Processing (DSP) slices.
  • It has a 900 MHz maximum operating frequency and supports a wide range of I/O standards, including LVCMOS, LVTTL, PCI, and LVDS.

Application

  • Digital signal processing (DSP)
  • Communications systems
  • Automotive applications
  • Industrial control systems
  • Aerospace and defense systems
  • Video and image processing
  • High-performance computing
  • Scientific research
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
RoHS: Details Series: XC3S4000
Number of Logic Elements: 62208 LE Adaptive Logic Modules - ALMs: 27648 ALM
Embedded Memory: 1.69 Mbit Number of I/Os: 633 I/O
Supply Voltage - Min: 1.14 V Supply Voltage - Max: 1.26 V
Minimum Operating Temperature: 0 C Maximum Operating Temperature: + 85 C
Data Rate: - Number of Transceivers: -
Mounting Style: SMD/SMT Package / Case: FBGA-900
Brand: Xilinx Distributed RAM: 432 kbit
Embedded Block RAM - EBR: 1728 kbit Maximum Operating Frequency: 280 MHz
Moisture Sensitive: Yes Number of Gates: 4000000
Operating Supply Voltage: 1.2 V Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 1 Subcategory: Programmable Logic ICs
Tradename: Spartan

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S4000-4FGG900C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S4000-4FG676C

Brands :  

Package :   BGA676

Description :   4000000 SYSTEM GATE 1.2 VOLT FPGA

Part Number :   XC3S4000-4FG900I

Brands :  

Package :   900-BBGA

Description :   4000000 SYSTEM GATE 1.2 VOLT FPGA

Part Number :   XC3S4000-4FGG676C

Brands :  

Package :   BGA-676

Description :   FPGA SPARTAN-3A 4M GATES 630MHz 676FBGA

Part Number :   XC3S4000-4FGG900I

Brands :  

Package :   900-BBGA

Description :   FPGA Spartan-3 Family 4M Gates 62208 Cells 630MHz 90nm Technology 1.2V 900Pin FBGA

Part Number :   XC3S4000-4FGG676I

Brands :  

Package :   FBGA676

Description :   FPGA Spartan®-3 Family 4M Gates 62208 Cells 630MHz 90nm Technology 1.2V

Part points

  • The XC3S4000-4FGG900C is an FPGA (Field-Programmable Gate Array) chip manufactured by Xilinx. It offers a capacity of 4 million system gates and has a speed grade of -4 (operating up to 500MHz). It belongs to the Spartan-3 family and is designed for various applications such as high-performance logic, digital signal processing, and embedded processing. The suffix "FGG900C" represents the package and speed grade of the chip.
  • Equivalent

    Some equivalent products to the XC3S4000-4FGG900C chip include Xilinx's XC3S4000-4FGG900I and XC3S4000-4FGG900E models. These products belong to the same family of Spartan-3 FPGAs from Xilinx, and have similar specifications and capabilities.
  • Features

    The XC3S4000-4FGG900C is an FPGA device from Xilinx. It has 4000 logic cells, a speed grade of -4, and operates with a supply voltage of 1.2V. The device is RoHS compliant and comes in a 900-ball flip-chip package. It also supports various configuration modes, such as Master Serial, Slave Serial, and SelectMAP.
  • Pinout

    The XC3S4000-4FGG900C is an FPGA (field-programmable gate array) with 4000K system gates capacity. It has a pin count of 900 and is part of the Spartan-3 family. The pin functions include general-purpose I/O pins, clock input/output pins, configuration interface pins, and power supply pins.
  • Manufacturer

    The manufacturer of the XC3S4000-4FGG900C is Xilinx Inc. Xilinx is a semiconductor company that specializes in the development and manufacturing of programmable logic devices and associated software tools. They are known for their advanced field-programmable gate array (FPGA) technology, which allows for flexible and customizable hardware solutions for a variety of industries including aerospace, automotive, telecommunications, and more.
  • Application Field

    The XC3S4000-4FGG900C is a field-programmable gate array (FPGA) suitable for applications in communications, industrial control, defense, and aerospace industries. With 4 million system gates, it offers high performance and flexibility, making it suitable for complex and demanding applications requiring real-time processing, signal processing, and interface capabilities.
  • Package

    The XC3S4000-4FGG900C chip is a Field-Programmable Gate Array (FPGA). Its package type is Ball Grid Array (BGA). The form factor is 900 pins, and the size is 31 mm x 31 mm.

Datasheet PDF

Preliminary Specification XC3S4000-4FGG900C PDF Download

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