Xilinx XC3S4000-4FGG676C

Part points

• The XC3S4000-4FGG676C chip is a member of the Spartan-3 FPGA family by Xilinx. It features a high-performance, low-cost FPGA design with 4.0 million system gates, 464 I/O pins, and a total of 2,016 available logic slices. It is suitable for a wide range of applications including networking, automotive, telecommunications, and industrial sectors.

• Equivalent

  Some equivalent products to the XC3S4000-4FGG676C chip are Xilinx XC3S4000-4FGG676I, Xilinx XC3S4000-4FGG900C, and Xilinx XC3S4000-4FGG900I.

• Features

  The XC3S4000-4FGG676C is a field-programmable gate array (FPGA) with 3,456 logic cells, 136,560 flip-flops, and 4,608 slices. It has a maximum speed grade of -4, which means it can operate at 166.67 MHz. It is housed in a Fine-pitch Ball Grid Array (FBGA) package with 676 pins.

• Pinout

  The XC3S4000-4FGG676C is a Field Programmable Gate Array (FPGA) with 676 pins. It is part of the Spartan-3 family and has 4000 slices. The specific pin functions and pin count breakdown can be found in the datasheet provided by the manufacturer, Xilinx.

• Manufacturer

  Xilinx is the manufacturer of the XC3S4000-4FGG676C. It is a semiconductor and software design company specializing in programmable logic devices and associated technologies.

• Application Field

  The XC3S4000-4FGG676C is a field-programmable gate array (FPGA) that can be used in various application areas such as telecommunications, data processing, networking, and embedded systems. It is suitable for applications that require high-speed processing, low power consumption, and flexibility to adapt to changing requirements.

• Package

  The XC3S4000-4FGG676C chip has a package type of FG676, which stands for Fine-Pitch Ball Grid Array with 676 balls. It has a form factor of 676C, referring to the specific arrangement and pin configuration of the ball grid array. The size of the chip is not explicitly mentioned in the given information.