Xilinx XC3S4000-4FGG676I

Part points

• The XC3S4000-4FGG676I is a programmable logic chip produced by Xilinx. It belongs to the Spartan-3 family and has 4000 logic cells. The 4FGG676I package indicates its physical form and pin configuration. This chip offers configurable processing capabilities and is widely used in various applications like telecommunications, automotive, industrial automation, and more.

• Equivalent

  There are no direct equivalent products to the XC3S4000-4FGG676I chip. However, comparable alternatives include the Xilinx XC3S4000-4FGG676C, XC3S4000-5FG676C, and XC3S4000-4FGG676 chips.

• Features

  XC3S4000-4FGG676I is a field-programmable gate array (FPGA) with 400,000 logic cells, 3.4Mbits of RAM, and 1,024 I/O pins. It operates on a 1.2V to 1.5V core voltage and offers various high-speed interfaces like DDR2, PCI Express, and Gigabit Ethernet. It is designed by Xilinx and comes in a 676-pin fine-grained ball grid array (FBGA) package.

• Pinout

  The XC3S4000-4FGG676I is a field-programmable gate array (FPGA) by Xilinx. It has 676 pins and is part of the Spartan-3 family. The specific pin count and function details for this FPGA can be found in the datasheet provided by Xilinx.

• Manufacturer

  The manufacturer of the XC3S4000-4FGG676I is Xilinx Inc. It is a technology company specializing in the development and manufacturing of programmable logic devices, system on chips, integrated circuits, and associated software tools.

• Application Field

  The XC3S4000-4FGG676I is a Field-Programmable Gate Array (FPGA) chip that can be used in various application areas such as communication systems, video processing, image processing, high-performance computing, and industrial control systems. It offers a high degree of flexibility and can be programmed to meet specific requirements in these domains.

• Package

  The package type of the XC3S4000-4FGG676I chip is a ball grid array (BGA). The form is integrated circuit (IC) and the size of the chip is 676 pins.