Xilinx XC3S200AN-4FT256I

Part points

• The XC3S200AN-4FT256I chip is a Spartan-3AN field-programmable gate array (FPGA) manufactured by Xilinx. It offers 200,000 logic cells, which can be programmed to perform various digital functions. The chip operates at a speed grade of -4, indicating a maximum operating frequency of 250 MHz. Its package type is FT256, and it can be used for applications like video processing, automotive, and industrial control systems.

• Equivalent

  Some equivalent products to the XC3S200AN-4FT256I chip are the XC3S200AN-4FGG256I, XC3S200AN-4FTG256I, and XC3S200AN-5FG256C.

• Features

  XC3S200AN-4FT256I is a Spartan-3AN FPGA by Xilinx. It has 200K system gates, 384 input/output pins, and operates at a maximum clock frequency of 400MHz. The FPGA supports 3.3V power supply and offers various I/O standards including LVCMOS, LVTTL, and LVDS. It features 8200 logic cells and supports advanced features like built-in IP cores and partial reconfiguration.

• Pinout

  The XC3S200AN-4FT256I is an FPGA (Field Programmable Gate Array) with a pin count of 256. The function of this device is to allow for the programmable logic implementation of custom digital circuits and systems.

• Manufacturer

  The manufacturer of the XC3S200AN-4FT256I is Xilinx. Xilinx is an American technology company specializing in the development and production of field-programmable gate arrays (FPGAs) and programmable logic devices (PLDs). They are known for their semiconductor products and software design tools used in industries such as aerospace, automotive, telecommunications, and more.

• Application Field

  The XC3S200AN-4FT256I is commonly used in applications such as industrial automation, communication systems, medical equipment, automotive electronics, and aerospace. It can be employed for tasks like digital signal processing, image and video processing, data encryption, and system control, due to its programmable logic capabilities and high-performance features.

• Package

  The XC3S200AN-4FT256I chip is a 256-pin fine pitch ball grid array (FBGA) package type. Its form factor is surface mount technology, and the size of the chip is 17mm x 17mm.