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Xilinx XC3S2000-4FGG900C 48HRS

Spartan®-3 Field Programmable Gate Array (FPGA) IC 565 737280 46080 900-BBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S2000-4FGG900C

Datasheet: XC3S2000-4FGG900C Datasheet (PDF)

Package/Case: BGA-900

RoHS Status:

Stock Condition: 2835 pcs, New Original

Product Type: Programmable Logic ICs

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $648.218 $648.218
189 $258.644 $48883.716
513 $250.000 $128250.000
999 $245.730 $245484.270

In Stock:2835 PCS

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Quick Quote

Please submit RFQ for XC3S2000-4FGG900C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S2000-4FGG900C General Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 565 737280 46080 900-BBGA

xc3s2000-4fgg900c

Features

  • It has a capacity of 2 million system gates, 68000 logic cells, and 360 DSP slices.
  • It has a maximum of 950 MHz clock frequency
  • It offers a 32-bit wide data path and supports Double Data Rate (DDR) memory interfaces.
  • It operates on a 1.2V core voltage and a 2.5V auxiliary voltage.

Application

  • This FPGA model is used in a wide range of applications including aerospace and defense, automotive, industrial automation, wired and wireless communications, and consumer electronics.
  • It can be used for high-speed signal processing, data processing, and control applications.
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
RoHS: Details Series: XC3S2000
Number of Logic Elements: 46080 LE Number of I/Os: 565 I/O
Supply Voltage - Min: 1.2 V Supply Voltage - Max: 1.2 V
Minimum Operating Temperature: 0 C Maximum Operating Temperature: + 85 C
Mounting Style: SMD/SMT Package / Case: FBGA-900
Brand: Xilinx Distributed RAM: 320 kbit
Embedded Block RAM - EBR: 720 kbit Maximum Operating Frequency: 280 MHz
Moisture Sensitive: Yes Number of Gates: 2000000
Operating Supply Voltage: 1.2 V Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 1 Subcategory: Programmable Logic ICs
Tradename: Spartan

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S2000-4FGG900C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   However,

Brands :  

Package :  

Description :   it is important to note that there may be differences in features and specifications among different models, and it is always recommended to consult the datasheet to ensure compatibility.

Part points

  • The XC3S2000-4FGG900C chip is a member of the Spartan-3 FPGA family designed by Xilinx. It offers a high gate count of 2 million, operating at a clock frequency of up to 400 MHz, and integrates 2000 logic cells. Its FGPA architecture allows for programmable hardware functionality, making it suitable for various applications in industries like telecommunications, automotive, and aerospace.
  • Features

    The XC3S2000-4FGG900C is a field-programmable gate array (FPGA) with 2 million system gates, capable of operating at a maximum frequency of 450 MHz. It includes 768 input/output pins, 57744 logic cells, and 4.5Mb of embedded RAM. It also offers advanced features such as built-in serial transceivers and dynamic power management capabilities.
  • Pinout

    The XC3S2000-4FGG900C is an FPGA integrated circuit with a pin count of 900. It is designed for high-performance applications and contains 2,000 slices. Its main functions include providing programmable logic, memory, and configurable I/Os for various digital systems.
  • Manufacturer

    The manufacturer of the XC3S2000-4FGG900C is Xilinx. Xilinx is a leading American technology company that specializes in the development and production of programmable logic devices and associated software tools. They are known for their field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs) used in various industries such as aerospace, automotive, telecommunications, and more.
  • Application Field

    The XC3S2000-4FGG900C is a Field-Programmable Gate Array (FPGA) typically used in applications that require high-processing capabilities, such as aerospace and defense systems, video processing, telecommunications, and high-performance computing. It offers high-speed processing, flexible design options, and a large number of input/output pins for interfacing with other electronic components.
  • Package

    The XC3S2000-4FGG900C chip comes in a FBGA (Fine-pitch Ball Grid Array) package type. It has a form factor of 900 (FGG900) and a size of 4.25mm x 4.25mm.

Datasheet PDF

Preliminary Specification XC3S2000-4FGG900C PDF Download

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