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Orders Over
$5000
BSM100GB60DLC
Trans IGBT Module N-CH 600V 130A 445W 7-Pin 34MM-1 Tray
Brands: Infineon Technologies
Mfr.Part #: BSM100GB60DLC
Datasheet: BSM100GB60DLC Datasheet (PDF)
Package/Case: Module
RoHS Status:
Stock Condition: 8,724 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $169.548 | $169.548 |
| 200 | $65.613 | $13122.600 |
| 500 | $63.308 | $31654.000 |
| 1000 | $62.167 | $62167.000 |
In Stock: 8,724 PCS
BSM100GB60DLC General Description
IGBT Module Single 600 V 130 A 445 W Chassis Mount Module
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Package | Bulk | Product Status | Obsolete |
| Configuration | Single | Voltage - Collector Emitter Breakdown (Max) | 600 V |
| Current - Collector (Ic) (Max) | 130 A | Power - Max | 445 W |
| Vce(on) (Max) @ Vge, Ic | 2.45V @ 15V, 100A | Current - Collector Cutoff (Max) | 500 µA |
| Input | Standard | NTC Thermistor | No |
| Operating Temperature | -40°C ~ 125°C | Mounting Type | Chassis Mount |
| Package / Case | Module | Supplier Device Package | Module |
| Base Product Number | BSM100 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The BSM100GB60DLC is a power module chip used for high-power switching applications, such as in electric vehicles or renewable energy systems. It offers high efficiency, low switching losses, and high thermal performance. This module is designed for easy integration into both residential and industrial applications.
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Equivalent
The equivalent products of BSM100GB60DLC chip are BSM100GB60DN2 and BSM100GB60DLCN2. These chips are part of the BSM100GB series of IGBT modules from Infineon Technologies, offering similar specifications and performance characteristics. -
Features
1. 100A/600V dual power Schottky module 2. Low Vf (1.35V) and low Eoff (55mJ) 3. Reduced electromagnetic interference 4. High efficiency in high power applications 5. Fast and reliable switching 6. Optimized for motor drives, inverters, UPS, and power supplies 7. 150°C max operating temperature -
Pinout
The BSM100GB60DLC is a dual-channel IGBT power module with a pin count of 28. It functions as a high-voltage, high-power switching device suitable for various applications such as motor drives, power supplies, and inverters. It can handle currents up to 100A and voltages up to 600V. -
Manufacturer
The manufacturer of the BSM100GB60DLC is Infineon Technologies AG. It is a German multinational semiconductor manufacturer. Infineon Technologies AG produces a wide range of semiconductors for various applications, including automotive, industrial, and consumer electronics. -
Application Field
BSM100GB60DLC is commonly used in industrial applications for motor drives, power supplies, and renewable energy systems. Its high power capability and low switching losses make it suitable for high-performance applications such as electric vehicles and hybrid vehicles. Additionally, it is also used in power distribution systems and grid-tied inverters for solar power plants. -
Package
The BSM100GB60DLC chip comes in a module package, specifically a dual-level converter module (DLC). It is in chip form and has a size of 100 mm x 140 mm.
We provide high quality products, thoughtful service and after sale guarantee
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Minimum order quantity starts from 1pcs.
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365 days quality guarantee for all products
